| 12406945 |
Moisture hermetic guard ring for semiconductor on insulator devices |
Mohammad Enamul Kabir, Conor P. Puls, Babita Dhayal, Han Li, Keith E. Zawadzki +3 more |
2025-09-02 |
|
| 12400997 |
Hybrid manufacturing with modified via-last process |
Abhishek A. Sharma, Wilfred Gomes, Mauro J. Kobrinsky, Van H. Le |
2025-08-26 |
|
| 12381193 |
Integrated circuit assemblies |
Wilfred Gomes, Abhishek A. Sharma, Van H. Le |
2025-08-05 |
|
| 12355002 |
Hyperchip |
Mark Bohr, Wilfred Gomes, Rajesh Kumar, Pooya Tadayon |
2025-07-08 |
|
| 12278229 |
Hybrid manufacturing for integrated circuit devices and assemblies |
Wilfred Gomes, Abhishek A. Sharma, Mauro J. Kobrinsky |
2025-04-15 |
|
| 12170273 |
Integrated circuit assemblies with direct chip attach to circuit boards |
Wilfred Gomes, Sanka Ganesan, Abhishek A. Sharma, Mauro J. Kobrinsky, Kevin J. Fischer |
2024-12-17 |
$33,648,000 |
| 12074138 |
Hyperchip |
Mark Bohr, Wilfred Gomes, Rajesh Kumar, Pooya Tadayon |
2024-08-27 |
$26,513,000 |
| 12014996 |
Moisture hermetic guard ring for semiconductor on insulator devices |
Mohammad Enamul Kabir, Conor P. Puls, Babita Dhayal, Han Li, Keith E. Zawadzki +3 more |
2024-06-18 |
$26,452,000 |
| 11984430 |
Hyperchip |
Mark Bohr, Wilfred Gomes, Rajesh Kumar, Pooya Tadayon |
2024-05-14 |
$33,809,000 |
| 11978727 |
Package on active silicon semiconductor packages |
Wilfred Gomes, Sanka Ganesan, Robert L. Sankman, Mark Bohr, Debendra Mallik |
2024-05-07 |
$26,756,000 |
| 11901347 |
Microelectronic package with three-dimensional (3D) monolithic memory die |
Wilfred Gomes, Mauro J. Kobrinsky, Tahir Ghani |
2024-02-13 |
$18,546,000 |
| 11854894 |
Integrated circuit device structures and double-sided electrical testing |
Valluri Rao, Patrick Morrow, Rishabh Mehandru, Kimin Jun, Kevin P. O'Brien +3 more |
2023-12-26 |
$39,948,000 |
| 11830829 |
Device, system and method for providing inductor structures |
Wilfred Gomes, Mark Bohr, Rajesh Kumar, Harish Krishnamurthy, Nachiket Desai |
2023-11-28 |
$31,872,000 |
| 11824041 |
Hyperchip |
Mark Bohr, Wilfred Gomes, Rajesh Kumar, Pooya Tadayon |
2023-11-21 |
$28,968,000 |
| 11817442 |
Hybrid manufacturing for integrated circuit devices and assemblies |
Wilfred Gomes, Abhishek A. Sharma, Mauro J. Kobrinsky |
2023-11-14 |
$31,444,000 |
| 11756886 |
Hybrid manufacturing of microeletronic assemblies with first and second integrated circuit structures |
Wilfred Gomes, Abhishek A. Sharma, Mauro J. Kobrinsky |
2023-09-12 |
$19,004,000 |
| 11444148 |
Recoiled metal thin film for 3D inductor with tunable core |
Gwang-Soo Kim, Aaron D. Lilak, Kumhyo Byon |
2022-09-13 |
$14,653,000 |
| 11387198 |
Device, system and method for providing inductor structures |
Wilfred Gomes, Mark Bohr, Rajesh Kumar, Harish Krishnamurthy, Nachiket Desai |
2022-07-12 |
$13,106,000 |
| 11335686 |
Transistors with back-side contacts to create three dimensional memory and logic |
Wilfred Gomes, Mauro J. Kobrinsky, Abhishek A. Sharma, Tahir Ghani, Rajesh Kumar |
2022-05-17 |
$14,251,000 |
| 11024601 |
Hyperchip |
Mark Bohr, Wilfred Gomes, Rajesh Kumar, Pooya Tadayon |
2021-06-01 |
$35,542,000 |
| 10886195 |
Systems and methods for improved through-silicon-vias |
Candi S. Cook |
2021-01-05 |
$27,050,000 |
| 10872820 |
Integrated circuit structures |
Bruce A. Block, Valluri Rao, Patrick Morrow, Rishabh Mehandru, Kimin Jun +3 more |
2020-12-22 |
$47,741,000 |
| 10811354 |
Fuse array for integrated circuit |
Gwang-Soo Kim |
2020-10-20 |
$43,271,000 |
| 8154121 |
Polymer interlayer dielectric and passivation materials for a microelectronic device |
Kunal Gaurang Shah, Michael Haverty, Sadasivan Shankar, Grant Kloster |
2012-04-10 |
$33,757,000 |
