Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406945 | Moisture hermetic guard ring for semiconductor on insulator devices | Mohammad Enamul Kabir, Conor P. Puls, Babita Dhayal, Han Li, Keith E. Zawadzki +3 more | 2025-09-02 |
| 12400997 | Hybrid manufacturing with modified via-last process | Abhishek A. Sharma, Wilfred Gomes, Mauro J. Kobrinsky, Van H. Le | 2025-08-26 |
| 12381193 | Integrated circuit assemblies | Wilfred Gomes, Abhishek A. Sharma, Van H. Le | 2025-08-05 |
| 12355002 | Hyperchip | Mark Bohr, Wilfred Gomes, Rajesh Kumar, Pooya Tadayon | 2025-07-08 |
| 12278229 | Hybrid manufacturing for integrated circuit devices and assemblies | Wilfred Gomes, Abhishek A. Sharma, Mauro J. Kobrinsky | 2025-04-15 |
| 12170273 | Integrated circuit assemblies with direct chip attach to circuit boards | Wilfred Gomes, Sanka Ganesan, Abhishek A. Sharma, Mauro J. Kobrinsky, Kevin J. Fischer | 2024-12-17 |
| 12074138 | Hyperchip | Mark Bohr, Wilfred Gomes, Rajesh Kumar, Pooya Tadayon | 2024-08-27 |
| 12014996 | Moisture hermetic guard ring for semiconductor on insulator devices | Mohammad Enamul Kabir, Conor P. Puls, Babita Dhayal, Han Li, Keith E. Zawadzki +3 more | 2024-06-18 |
| 11984430 | Hyperchip | Mark Bohr, Wilfred Gomes, Rajesh Kumar, Pooya Tadayon | 2024-05-14 |
| 11978727 | Package on active silicon semiconductor packages | Wilfred Gomes, Sanka Ganesan, Robert L. Sankman, Mark Bohr, Debendra Mallik | 2024-05-07 |
| 11901347 | Microelectronic package with three-dimensional (3D) monolithic memory die | Wilfred Gomes, Mauro J. Kobrinsky, Tahir Ghani | 2024-02-13 |
| 11854894 | Integrated circuit device structures and double-sided electrical testing | Valluri Rao, Patrick Morrow, Rishabh Mehandru, Kimin Jun, Kevin P. O'Brien +3 more | 2023-12-26 |
| 11830829 | Device, system and method for providing inductor structures | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Harish Krishnamurthy, Nachiket Desai | 2023-11-28 |
| 11824041 | Hyperchip | Mark Bohr, Wilfred Gomes, Rajesh Kumar, Pooya Tadayon | 2023-11-21 |
| 11817442 | Hybrid manufacturing for integrated circuit devices and assemblies | Wilfred Gomes, Abhishek A. Sharma, Mauro J. Kobrinsky | 2023-11-14 |
| 11756886 | Hybrid manufacturing of microeletronic assemblies with first and second integrated circuit structures | Wilfred Gomes, Abhishek A. Sharma, Mauro J. Kobrinsky | 2023-09-12 |
| 11444148 | Recoiled metal thin film for 3D inductor with tunable core | Gwang-Soo Kim, Aaron D. Lilak, Kumhyo Byon | 2022-09-13 |
| 11387198 | Device, system and method for providing inductor structures | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Harish Krishnamurthy, Nachiket Desai | 2022-07-12 |
| 11335686 | Transistors with back-side contacts to create three dimensional memory and logic | Wilfred Gomes, Mauro J. Kobrinsky, Abhishek A. Sharma, Tahir Ghani, Rajesh Kumar | 2022-05-17 |
| 11024601 | Hyperchip | Mark Bohr, Wilfred Gomes, Rajesh Kumar, Pooya Tadayon | 2021-06-01 |
| 10886195 | Systems and methods for improved through-silicon-vias | Candi S. Cook | 2021-01-05 |
| 10872820 | Integrated circuit structures | Bruce A. Block, Valluri Rao, Patrick Morrow, Rishabh Mehandru, Kimin Jun +3 more | 2020-12-22 |
| 10811354 | Fuse array for integrated circuit | Gwang-Soo Kim | 2020-10-20 |
| 8154121 | Polymer interlayer dielectric and passivation materials for a microelectronic device | Kunal Gaurang Shah, Michael Haverty, Sadasivan Shankar, Grant Kloster | 2012-04-10 |