| 12500547 |
Cabling systems for rooftop photovoltaic solar systems |
Kristine Little |
2025-12-16 |
|
| 12317590 |
Substrate-free integrated circuit structures |
Biswajeet Guha, Brian J. Greene, Avyaya Jayanthinarasimham, Ayan Kar, Benjamin Orr +9 more |
2025-05-27 |
|
| 12170273 |
Integrated circuit assemblies with direct chip attach to circuit boards |
Wilfred Gomes, Sanka Ganesan, Abhishek A. Sharma, Doug B. Ingerly, Mauro J. Kobrinsky |
2024-12-17 |
$33,648,000 |
| 12166031 |
Substrate-less electrostatic discharge (ESD) integrated circuit structures |
Biswajeet Guha, Brian J. Greene, Daniel Schulman, William Hsu, Chung-Hsun Lin +1 more |
2024-12-10 |
$13,394,000 |
| 11690211 |
Thin film transistor based memory cells on both sides of a layer of logic devices |
Wilfred Gomes, Mauro J. Kobrinsky, Conor P. Puls, Bernhard Sell, Abhishek A. Sharma +1 more |
2023-06-27 |
$18,721,000 |
| 11239238 |
Thin film transistor based memory cells on both sides of a layer of logic devices |
Wilfred Gomes, Mauro J. Kobrinsky, Conor P. Puls, Bernhard Sell, Abhishek A. Sharma +1 more |
2022-02-01 |
$16,992,000 |
| 10593626 |
AVD hardmask for damascene patterning |
Ruth A. Brain, Michael A. Childs |
2020-03-17 |
$21,927,000 |
| 10229879 |
Thickened stress relief and power distribution layer |
Christopher M. Pelto, Andrew W. Yeoh |
2019-03-12 |
$21,255,000 |
| 9984922 |
Interconnects having sealing structures to enable selective metal capping layers |
Jun He, Ying Zhou, Peter K. Moon |
2018-05-29 |
$28,242,000 |
| 9780038 |
AVD hardmask for damascene patterning |
Ruth A. Brain, Michael A. Childs |
2017-10-03 |
$11,313,000 |
| 9627312 |
On-chip capacitors and methods of assembling same |
Michael A. Childs, Sanjay Natarajan |
2017-04-18 |
$8,310,000 |
| 9502281 |
AVD hardmask for damascene patterning |
Ruth A. Brain, Michael A. Childs |
2016-11-22 |
$9,157,000 |
| 9496173 |
Thickened stress relief and power distribution layer |
Christopher M. Pelto, Andrew W. Yeoh |
2016-11-15 |
$10,003,000 |
| 9437545 |
Interconnects having sealing structures to enable selective metal capping layers |
Jun He, Ying Zhou, Peter K. Moon |
2016-09-06 |
$9,244,000 |
| 9123727 |
Airgap interconnect with hood layer and method of forming |
— |
2015-09-01 |
$13,376,000 |
| 8987859 |
Techniques for enhancing dielectric breakdown performance |
Pavel S. Plekhanov, Qiang Fu, Hiroki Hiramatsu |
2015-03-24 |
$15,411,000 |
| 8928125 |
Interconnects having sealing structures to enable selective metal capping layers |
Jun He, Ying Zhou, Peter K. Moon |
2015-01-06 |
$26,007,000 |
| 8827550 |
Thermal sensor using a vibrating MEMS resonator of a chip interconnect layer |
Mohamed A. Abdelmoneum, Tawfik M. Rahal-Arabi, Gregory F. Taylor, Andrew W. Yeoh |
2014-09-09 |
$26,381,000 |
| 8278718 |
Stressed barrier plug slot contact structure for transistor performance enhancement |
Vinay Chikarmane, Brennan Peterson |
2012-10-02 |
$10,164,000 |
| 8120119 |
Stressed barrier plug slot contact structure for transistor performance enhancement |
Vinay Chikarmane, Brennan Peterson |
2012-02-21 |
$21,312,000 |
| 8058710 |
Interconnects having sealing structures to enable selective metal capping layers |
Jun He, Ying Zhou, Peter K. Moon |
2011-11-15 |
$27,540,000 |
| 7968952 |
Stressed barrier plug slot contact structure for transistor performance enhancement |
Vinay Chikarmane, Brennan Peterson |
2011-06-28 |
$18,630,000 |
| 7768126 |
Barrier formation and structure to use in semiconductor devices |
Vinay Chikarmane, Brennan Peterson |
2010-08-03 |
$10,607,000 |
| 7719062 |
Tuned tensile stress low resistivity slot contact structure for n-type transistor performance enhancement |
Vinay Chikarmane, Brennan Peterson |
2010-05-18 |
$11,091,000 |
| 7582558 |
Reducing corrosion in copper damascene processes |
Vinay Chikarmane, Brennan Peterson |
2009-09-01 |
$29,239,000 |
