Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnects having sealing structures to enable selective metal capping layers

Interconnects having sealing structures to enable selective metal capping layers

US Patent 9437545 · Granted Sep 6, 2016

Estimated economic value: $9,244,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Filter structure and filter device2025
Cabling systems for rooftop photovoltaic solar systems2025
Resonance circuit and filtering device2025
Semiconductor device package and methods of formation2025
Reduction of cracks in redistribution structure2025
Fan-out package structures with cascaded openings in enhancement layer2025
Band-pass filter circuit and multiplexer2025
3D filter circuit and 3D filter2025
Chip package structure and storage system2025
Delamination control of dielectric layers of integrated circuit chips2025
Package component2025
Semiconductor package and method of forming same2025