| 9984922 |
Interconnects having sealing structures to enable selective metal capping layers |
Jun He, Kevin J. Fischer, Ying Zhou |
2018-05-29 |
$28,242,000 |
| 9437545 |
Interconnects having sealing structures to enable selective metal capping layers |
Jun He, Kevin J. Fischer, Ying Zhou |
2016-09-06 |
$9,244,000 |
| 8928125 |
Interconnects having sealing structures to enable selective metal capping layers |
Jun He, Kevin J. Fischer, Ying Zhou |
2015-01-06 |
$26,007,000 |
| 8227335 |
Forming a copper diffusion barrier |
Steven W. Johnston, Valery M. Dubin, Michael L. McSwiney |
2012-07-24 |
$18,521,000 |
| 8058710 |
Interconnects having sealing structures to enable selective metal capping layers |
Jun He, Kevin J. Fischer, Ying Zhou |
2011-11-15 |
$27,540,000 |
| 7629268 |
Method for an improved air gap interconnect structure |
Valery M. Dubin |
2009-12-08 |
$15,228,000 |
| 7586196 |
Apparatus for an improved air gap interconnect structure |
Valery M. Dubin |
2009-09-08 |
$22,439,000 |
| 7525196 |
Protection of seedlayer for electroplating |
Valery M. Dubin |
2009-04-28 |
$19,079,000 |
| 7402519 |
Interconnects having sealing structures to enable selective metal capping layers |
Jun He, Kevin J. Fischer, Ying Zhou |
2008-07-22 |
$18,979,000 |
| 7326981 |
Methods and apparatuses for producing a polymer memory device |
Makarem A. Hussein, Ebrahim Andideh, Daniel Diana |
2008-02-05 |
$13,136,000 |
| 7304388 |
Method and apparatus for an improved air gap interconnect structure |
Valery M. Dubin |
2007-12-04 |
$21,616,000 |
| 7279423 |
Forming a copper diffusion barrier |
Steven W. Johnston, Valery M. Dubin, Michael L. McSwiney |
2007-10-09 |
$11,205,000 |
| 7239019 |
Selectively converted inter-layer dielectric |
Jihperng Leu, Grant Kloster, David H. Gracias, Lee Rockford, Chris Barns |
2007-07-03 |
$20,127,000 |
| 7223694 |
Method for improving selectivity of electroless metal deposition |
Chin-Chang Cheng, Valery M. Dubin |
2007-05-29 |
$13,871,000 |
| 7078754 |
Methods and apparatuses for producing a polymer memory device |
Makarem A. Hussein, Ebrahim Andideh, Daniel Diana |
2006-07-18 |
$11,508,000 |
| 7060617 |
Method of protecting a seed layer for electroplating |
Valery M. Dubin |
2006-06-13 |
$12,187,000 |
| 7018918 |
Method of forming a selectively converted inter-layer dielectric using a porogen material |
Grant Kloster, Kevin P. O'Brien, Michael Goodner, Jihperng Leu, David H. Gracias +2 more |
2006-03-28 |
$11,012,000 |
| 6977435 |
Thick metal layer integrated process flow to improve power delivery and mechanical buffering |
Sarah Kim, Bob Martell, Dave Ayers, R. Scott List, Steven Towle |
2005-12-20 |
$37,307,000 |
| 6943121 |
Selectively converted inter-layer dielectric |
Jihperng Leu, Grant Kloster, David H. Gracias, Lee Rockford, Chris Barns |
2005-09-13 |
$17,645,000 |
| 6908829 |
Method of forming an air gap intermetal layer dielectric (ILD) by utilizing a dielectric material to bridge underlying metal lines |
Makarem A. Hussein, Jim Powers, Kevin P. O'Brien |
2005-06-21 |
$21,477,000 |
| 6900063 |
Methods and apparatuses for producing a polymer memory device |
Makarem A. Hussein, Ebrahim Andideh, Daniel Diana |
2005-05-31 |
$34,079,000 |
| 6878465 |
Under bump metallurgy for Lead-Tin bump over copper pad |
Zhiyong Ma, Madhav Datta |
2005-04-12 |
$19,475,000 |
| 6833320 |
Removing sacrificial material by thermal decomposition |
Robert Meagley, Kevin P. O'Brien |
2004-12-21 |
$44,553,000 |
| 6707120 |
Field effect transistor |
Payman Aminzadeh, Reza Arghavani |
2004-03-16 |
$26,262,000 |
| 6703069 |
Under bump metallurgy for lead-tin bump over copper pad |
Zhiyong Ma, Madhav Datta |
2004-03-09 |
$36,606,000 |
