Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984922 | Interconnects having sealing structures to enable selective metal capping layers | Jun He, Kevin J. Fischer, Ying Zhou | 2018-05-29 |
| 9437545 | Interconnects having sealing structures to enable selective metal capping layers | Jun He, Kevin J. Fischer, Ying Zhou | 2016-09-06 |
| 8928125 | Interconnects having sealing structures to enable selective metal capping layers | Jun He, Kevin J. Fischer, Ying Zhou | 2015-01-06 |
| 8227335 | Forming a copper diffusion barrier | Steven W. Johnston, Valery M. Dubin, Michael L. McSwiney | 2012-07-24 |
| 8058710 | Interconnects having sealing structures to enable selective metal capping layers | Jun He, Kevin J. Fischer, Ying Zhou | 2011-11-15 |
| 7629268 | Method for an improved air gap interconnect structure | Valery M. Dubin | 2009-12-08 |
| 7586196 | Apparatus for an improved air gap interconnect structure | Valery M. Dubin | 2009-09-08 |
| 7525196 | Protection of seedlayer for electroplating | Valery M. Dubin | 2009-04-28 |
| 7402519 | Interconnects having sealing structures to enable selective metal capping layers | Jun He, Kevin J. Fischer, Ying Zhou | 2008-07-22 |
| 7326981 | Methods and apparatuses for producing a polymer memory device | Makarem A. Hussein, Ebrahim Andideh, Daniel Diana | 2008-02-05 |
| 7304388 | Method and apparatus for an improved air gap interconnect structure | Valery M. Dubin | 2007-12-04 |
| 7279423 | Forming a copper diffusion barrier | Steven W. Johnston, Valery M. Dubin, Michael L. McSwiney | 2007-10-09 |
| 7239019 | Selectively converted inter-layer dielectric | Jihperng Leu, Grant Kloster, David H. Gracias, Lee Rockford, Chris Barns | 2007-07-03 |
| 7223694 | Method for improving selectivity of electroless metal deposition | Chin-Chang Cheng, Valery M. Dubin | 2007-05-29 |
| 7078754 | Methods and apparatuses for producing a polymer memory device | Makarem A. Hussein, Ebrahim Andideh, Daniel Diana | 2006-07-18 |
| 7060617 | Method of protecting a seed layer for electroplating | Valery M. Dubin | 2006-06-13 |
| 7018918 | Method of forming a selectively converted inter-layer dielectric using a porogen material | Grant Kloster, Kevin P. O'Brien, Michael Goodner, Jihperng Leu, David H. Gracias +2 more | 2006-03-28 |
| 6977435 | Thick metal layer integrated process flow to improve power delivery and mechanical buffering | Sarah Kim, Bob Martell, Dave Ayers, R. Scott List, Steven Towle | 2005-12-20 |
| 6943121 | Selectively converted inter-layer dielectric | Jihperng Leu, Grant Kloster, David H. Gracias, Lee Rockford, Chris Barns | 2005-09-13 |
| 6908829 | Method of forming an air gap intermetal layer dielectric (ILD) by utilizing a dielectric material to bridge underlying metal lines | Makarem A. Hussein, Jim Powers, Kevin P. O'Brien | 2005-06-21 |
| 6900063 | Methods and apparatuses for producing a polymer memory device | Makarem A. Hussein, Ebrahim Andideh, Daniel Diana | 2005-05-31 |
| 6878465 | Under bump metallurgy for Lead-Tin bump over copper pad | Zhiyong Ma, Madhav Datta | 2005-04-12 |
| 6833320 | Removing sacrificial material by thermal decomposition | Robert Meagley, Kevin P. O'Brien | 2004-12-21 |
| 6707120 | Field effect transistor | Payman Aminzadeh, Reza Arghavani | 2004-03-16 |
| 6703069 | Under bump metallurgy for lead-tin bump over copper pad | Zhiyong Ma, Madhav Datta | 2004-03-09 |