Issued Patents All Time
Showing 25 most recent of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8992806 | Antireflective coatings for via fill and photolithography applications and methods of preparation thereof | Bo Li, Joseph Kennedy, Nancy Iwamoto, Mark A. Fradkin, Makarem A. Hussein +2 more | 2015-03-31 |
| 8513111 | Forming semiconductor structures | Robert Meagley, Kevin P. O'Brien, Tian-An Chen, James M. Powers, Huey-Chiang Liou | 2013-08-20 |
| 8104172 | Method buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer | Kevin J. Lee | 2012-01-31 |
| 8053159 | Antireflective coatings for via fill and photolithography applications and methods of preparation thereof | Bo Li, Joseph Kennedy, Nancy Iwamoto, Victor Lu, Roger Leung +2 more | 2011-11-08 |
| 8003293 | Pixelated photoresists | Robert Meagley, Bob Leet, Michael L. McSwiney | 2011-08-23 |
| 7790630 | Silicon-doped carbon dielectrics | George Andrew Antonelli | 2010-09-07 |
| 7732936 | Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer | Kevin J. Lee | 2010-06-08 |
| 7658975 | Sealing porous dielectric materials | Grant Kloster, Robert Meagley, Kevin P. O'Brien | 2010-02-09 |
| 7615337 | Photoactive resist capping layer | Robert Meagley, Michael L. McSwiney, Robert Leet, Manish Chandhok | 2009-11-10 |
| 7595555 | Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures | James S. Clarke | 2009-09-29 |
| 7585615 | Composite photoresist for modifying die-side bumps | Kurt Schultz, Kevin J. Lee, Shane Nolen | 2009-09-08 |
| 7572732 | Method to modulate etch rate in SLAM | Robert Meagley, Kevin P. O'Brien | 2009-08-11 |
| 7563727 | Low-k dielectric layer formed from aluminosilicate precursors | — | 2009-07-21 |
| 7560165 | Sealing porous dielectric materials | Grant Kloster, Robert Meagley, Kevin P. O'Brien, Don Bruner | 2009-07-14 |
| 7470450 | Forming a silicon nitride film | Michael L. McSwiney, Mansour Moinpour | 2008-12-30 |
| 7466025 | Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide | Jihperng Leu | 2008-12-16 |
| 7452728 | Metal ion separation from aqueous solutions using photoswitchable ionophores | Bob Leet, Robert Meagley, Michael L. McSwiney | 2008-11-18 |
| 7439179 | Healing detrimental bonds in deposited materials | — | 2008-10-21 |
| 7365375 | Organic-framework zeolite interlayer dielectrics | Mansour Moinpour, Grant Kloster, Boyan Boyanov | 2008-04-29 |
| 7358597 | UV-activated dielectric layer | — | 2008-04-15 |
| 7344972 | Photosensitive dielectric layer | Kevin P. O'Brien, Grant Kloster, Robert Meagley | 2008-03-18 |
| 7303989 | Using zeolites to improve the mechanical strength of low-k interlayer dielectrics | Boyan Boyanov, Grant Kloster | 2007-12-04 |
| 7294568 | Formation of air gaps in an interconnect structure using a thin permeable hard mask and resulting structures | Kevin P. O'Brien, Grant Kloster | 2007-11-13 |
| 7241707 | Layered films formed by controlled phase segregation | Robert Meagley, Michael J. Leeson, Bob Leet, Michael L. McSwiney, Shan Clark | 2007-07-10 |
| 7235344 | Energy harvesting molecules and photoresist technology | Robert Meagley, Robert Leet, Michael L. McSwiney | 2007-06-26 |