| 8992806 |
Antireflective coatings for via fill and photolithography applications and methods of preparation thereof |
Bo Li, Joseph Kennedy, Nancy Iwamoto, Mark A. Fradkin, Makarem A. Hussein +2 more |
2015-03-31 |
$10,382,000 |
| 8513111 |
Forming semiconductor structures |
Robert Meagley, Kevin P. O'Brien, Tian-An Chen, James M. Powers, Huey-Chiang Liou |
2013-08-20 |
$17,431,000 |
| 8104172 |
Method buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer |
Kevin J. Lee |
2012-01-31 |
$29,732,000 |
| 8053159 |
Antireflective coatings for via fill and photolithography applications and methods of preparation thereof |
Bo Li, Joseph Kennedy, Nancy Iwamoto, Victor Lu, Roger Leung +2 more |
2011-11-08 |
$13,789,000 |
| 8003293 |
Pixelated photoresists |
Robert Meagley, Bob Leet, Michael L. McSwiney |
2011-08-23 |
$17,183,000 |
| 7790630 |
Silicon-doped carbon dielectrics |
George Andrew Antonelli |
2010-09-07 |
$9,640,000 |
| 7732936 |
Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer |
Kevin J. Lee |
2010-06-08 |
$11,764,000 |
| 7658975 |
Sealing porous dielectric materials |
Grant Kloster, Robert Meagley, Kevin P. O'Brien |
2010-02-09 |
$29,195,000 |
| 7615337 |
Photoactive resist capping layer |
Robert Meagley, Michael L. McSwiney, Robert Leet, Manish Chandhok |
2009-11-10 |
$23,460,000 |
| 7595555 |
Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures |
James S. Clarke |
2009-09-29 |
$24,442,000 |
| 7585615 |
Composite photoresist for modifying die-side bumps |
Kurt Schultz, Kevin J. Lee, Shane Nolen |
2009-09-08 |
$22,439,000 |
| 7572732 |
Method to modulate etch rate in SLAM |
Robert Meagley, Kevin P. O'Brien |
2009-08-11 |
$32,202,000 |
| 7563727 |
Low-k dielectric layer formed from aluminosilicate precursors |
— |
2009-07-21 |
$22,981,000 |
| 7560165 |
Sealing porous dielectric materials |
Grant Kloster, Robert Meagley, Kevin P. O'Brien, Don Bruner |
2009-07-14 |
$21,399,000 |
| 7470450 |
Forming a silicon nitride film |
Michael L. McSwiney, Mansour Moinpour |
2008-12-30 |
$13,967,000 |
| 7466025 |
Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide |
Jihperng Leu |
2008-12-16 |
$21,903,000 |
| 7452728 |
Metal ion separation from aqueous solutions using photoswitchable ionophores |
Bob Leet, Robert Meagley, Michael L. McSwiney |
2008-11-18 |
$14,632,000 |
| 7439179 |
Healing detrimental bonds in deposited materials |
— |
2008-10-21 |
$17,085,000 |
| 7365375 |
Organic-framework zeolite interlayer dielectrics |
Mansour Moinpour, Grant Kloster, Boyan Boyanov |
2008-04-29 |
$13,885,000 |
| 7358597 |
UV-activated dielectric layer |
— |
2008-04-15 |
$20,104,000 |
| 7344972 |
Photosensitive dielectric layer |
Kevin P. O'Brien, Grant Kloster, Robert Meagley |
2008-03-18 |
$17,443,000 |
| 7303989 |
Using zeolites to improve the mechanical strength of low-k interlayer dielectrics |
Boyan Boyanov, Grant Kloster |
2007-12-04 |
$21,616,000 |
| 7294568 |
Formation of air gaps in an interconnect structure using a thin permeable hard mask and resulting structures |
Kevin P. O'Brien, Grant Kloster |
2007-11-13 |
$26,433,000 |
| 7241707 |
Layered films formed by controlled phase segregation |
Robert Meagley, Michael J. Leeson, Bob Leet, Michael L. McSwiney, Shan Clark |
2007-07-10 |
$14,625,000 |
| 7235344 |
Energy harvesting molecules and photoresist technology |
Robert Meagley, Robert Leet, Michael L. McSwiney |
2007-06-26 |
$20,503,000 |
