Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8963421 | Electroluminescent device including moisture barrier layer | Shu-Hao Syu, Hung-En Tu, Chih-Chieh Wang | 2015-02-24 |
| 8299617 | Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects | Xiaorong Morrow, Markus Kuhn, Jose Maiz | 2012-10-30 |
| 7727892 | Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects | Xiaorong Morrow, Markus Kuhn, Jose Maiz | 2010-06-01 |
| 7466025 | Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide | Michael Goodner | 2008-12-16 |
| 7348283 | Mechanically robust dielectric film and stack | Jun He | 2008-03-25 |
| 7339271 | Metal-metal oxide etch stop/barrier for integrated circuit interconnects | Xiaorong Morrow, Markus Kuhn, Jose Maiz | 2008-03-04 |
| 7320935 | Semiconductor device using an interconnect | Christopher D. Thomas | 2008-01-22 |
| 7294934 | Low-K dielectric structure and method | Grant Kloster, Xiarong Morrow | 2007-11-13 |
| 7239019 | Selectively converted inter-layer dielectric | Grant Kloster, David H. Gracias, Lee Rockford, Peter K. Moon, Chris Barns | 2007-07-03 |
| 7214594 | Method of making semiconductor device using a novel interconnect cladding layer | Lawrence Wong, Grant Kloster, Andrew Ott, Patrick Morrow | 2007-05-08 |
| 7175970 | Mechanically robust interconnect for low-k dielectric material using post treatment | Jun He | 2007-02-13 |
| 7164206 | Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer | Grant Kloster, Lawrence Wong, Andrew Ott, Patrick Marrow | 2007-01-16 |
| 7145245 | Low-k dielectric film with good mechanical strength that varies in local porosity depending on location on substrate—therein | Grant Kloster, Lee Rockford | 2006-12-05 |
| 7018918 | Method of forming a selectively converted inter-layer dielectric using a porogen material | Grant Kloster, Kevin P. O'Brien, Michael Goodner, David H. Gracias, Lee Rockford +2 more | 2006-03-28 |
| 6998216 | Mechanically robust interconnect for low-k dielectric material using post treatment | Jun He | 2006-02-14 |
| 6992391 | Dual-damascene interconnects without an etch stop layer by alternating ILDs | Andrew Ott, Lawrence Wong, Patrick Morrow, Grant Kloster | 2006-01-31 |
| 6964919 | Low-k dielectric film with good mechanical strength | Grant Kloster, Lee Rockford | 2005-11-15 |
| 6943121 | Selectively converted inter-layer dielectric | Grant Kloster, David H. Gracias, Lee Rockford, Peter K. Moon, Chris Barns | 2005-09-13 |
| 6924222 | Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide | Michael Goodner | 2005-08-02 |
| 6903461 | Semiconductor device having a region of a material which is vaporized upon exposing to ultraviolet radiation | Grant Kloster, Hyun-Mog Park | 2005-06-07 |
| 6867125 | Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material | Grant Kloster, Hyun-Mog Park | 2005-03-15 |
| 6846755 | Bonding a metal component to a low-k dielectric material | Grant Kloster | 2005-01-25 |
| 6794755 | Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement | Jose Maiz, Xiaorong Morrow, Thomas Marieb, Carolyn Block, Paul McGregor +2 more | 2004-09-21 |
| 6743712 | Method of making a semiconductor device by forming a masking layer with a tapered etch profile | Hyun-Mog Park, Chih-I Wu | 2004-06-01 |
| 6734118 | Dielectric material treatment | Grant Kloster, David Staines | 2004-05-11 |