Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468357 | Stretchable electronics fabrication method with strain redistribution layer | Rajendra C. Dias, Tatyana N. Andryushchenko, Mauro J. Kobrinsky, Aleksandar Aleksov | 2019-11-05 |
| 10204855 | Bendable and stretchable electronic devices and methods | Alejandro X. Levander, Tatyana N. Andryushchenko, Mauro J. Kobrinsky, Aleksandar Aleksov, Dilan Seneviratne +3 more | 2019-02-12 |
| 10206277 | Gradient encapsulant protection of devices in stretchable electronics | Rajendra C. Dias, Manish Dubey, Tatyana N. Andryushchenko, Aleksandar Aleksov | 2019-02-12 |
| 7087538 | Method to fill the gap between coupled wafers | Grant Kloster, Shriram Ramanathan | 2006-08-08 |
| 6734118 | Dielectric material treatment | Grant Kloster, Jihperng Leu | 2004-05-11 |