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Home › Method to fill the gap between coupled wafers

Method to fill the gap between coupled wafers

US Patent 7087538 · Granted Aug 8, 2006

Estimated economic value: $12,359,000 ⓘ

Assignee

Intel

Inventors

David Staines (5 patents)
Grant Kloster (59 patents)
Shriram Ramanathan (47 patents)

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