| 11854945 |
Underfill material flow control for reduced die-to-die spacing in semiconductor packages |
Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Lars D. Skoglund |
2023-12-26 |
|
| 10763220 |
Systems and methods for electromagnetic interference shielding |
Mitul Modi |
2020-09-01 |
$24,773,000 |
| 10685949 |
Flexible electronic system with wire bonds |
Aleksandar Aleksov, Mauro J. Kobrinsky, Johanna M. Swan |
2020-06-16 |
$36,850,000 |
| 10634594 |
Membrane test for mechanical testing of stretchable electronics |
Ravindranth V. Mahajan, Pramod Malatkar, Steven A. Klein, Vijay Subramania, Aleksandar Aleksov +1 more |
2020-04-28 |
$36,717,000 |
| 10615128 |
Systems and methods for electromagnetic interference shielding |
Anna M. Prakash, Joshua D. Heppner, Eric J. Li, Nachiket R. Raravikar |
2020-04-07 |
$35,530,000 |
| 10535615 |
Electronic package that includes multi-layer stiffener |
Manish Dubey, Srikant Nekkanty, Patrick Nardi |
2020-01-14 |
$30,813,000 |
| 10468357 |
Stretchable electronics fabrication method with strain redistribution layer |
Tatyana N. Andryushchenko, Mauro J. Kobrinsky, Aleksandar Aleksov, David Staines |
2019-11-05 |
$22,190,000 |
| 10461007 |
Semiconductor package with electromagnetic interference shielding |
Nachiket R. Raravikar |
2019-10-29 |
$25,165,000 |
| 10325866 |
Electronic device packages with conformal EMI shielding and related methods |
Eric J. Li, Joshua D. Heppner, Mitul Modi |
2019-06-18 |
$21,210,000 |
| 10229887 |
Systems and methods for electromagnetic interference shielding |
Mitul Modi |
2019-03-12 |
$21,255,000 |
| 10224290 |
Electromagnetically shielded electronic devices and related systems and methods |
Takashi Kumamoto, Yoshishiro Tomita, Mitul Modi, Joshua D. Heppner, Eric J. Li |
2019-03-05 |
$19,977,000 |
| 10206277 |
Gradient encapsulant protection of devices in stretchable electronics |
Manish Dubey, Tatyana N. Andryushchenko, Aleksandar Aleksov, David Staines |
2019-02-12 |
$25,597,000 |
| 10192810 |
Underfill material flow control for reduced die-to-die spacing in semiconductor packages |
Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Lars D. Skoglund |
2019-01-29 |
$23,219,000 |
| 9991211 |
Semiconductor package having an EMI shielding layer |
Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Joshua D. Heppner, Ann Jinyan Xu +2 more |
2018-06-05 |
$24,427,000 |
| 9953929 |
Systems and methods for electromagnetic interference shielding |
Anna M. Prakash, Joshua D. Heppner, Eric J. Li, Nachiket R. Raravikar |
2018-04-24 |
$19,097,000 |
| 9887104 |
Electronic package and method of connecting a first die to a second die to form an electronic package |
Manish Dubey, Patrick Nardi, David Woodhams |
2018-02-06 |
$17,987,000 |
| 9847304 |
Electronic device packages with conformal EMI shielding and related methods |
Eric J. Li, Joshua D. Heppner, Mitul Modi |
2017-12-19 |
$19,551,000 |
| 9786517 |
Ablation method and recipe for wafer level underfill material patterning and removal |
Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Danish Faruqui, Tyler N. Osborn +2 more |
2017-10-10 |
$9,084,000 |
| 9721906 |
Electronic package with corner supports |
Manish Dubey, Baris Bicen, Digvijay A. Raorane, Bharat P. Penmecha |
2017-08-01 |
$11,137,000 |
| 9704811 |
Perforated conductive material for EMI shielding of semiconductor device and components |
Joshua D. Heppner, Mitul Modi, Anna M. Prakash |
2017-07-11 |
$8,311,000 |
| 9685413 |
Semiconductor package having an EMI shielding layer |
Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Joshua D. Heppner, Ann Jinyan Xu +2 more |
2017-06-20 |
$9,273,000 |
| 9591758 |
Flexible electronic system with wire bonds |
Aleksandar Aleksov, Mauro J. Kobrinsky, Johanna M. Swan |
2017-03-07 |
$9,849,000 |
| 9508660 |
Microelectronic die having chamfered corners |
Manish Dubey, Emre Armagan, Lars D. Skoglund |
2016-11-29 |
$9,403,000 |
| 9431274 |
Method for reducing underfill filler settling in integrated circuit packages |
Suriyakala Ramalingam, Manish Dubey, Hsin-Yu Li, Michelle S. Phen, Hitesh Arora +3 more |
2016-08-30 |
$15,019,000 |
| 9230833 |
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures |
Manish Dubey, Yonghao Xiu, Arjun Krishnan, Yiqun Bai, Purushotham Kaushik Muthur Srinath |
2016-01-05 |
$11,513,000 |
