Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854945 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Lars D. Skoglund | 2023-12-26 |
| 10763220 | Systems and methods for electromagnetic interference shielding | Mitul Modi | 2020-09-01 |
| 10685949 | Flexible electronic system with wire bonds | Aleksandar Aleksov, Mauro J. Kobrinsky, Johanna M. Swan | 2020-06-16 |
| 10634594 | Membrane test for mechanical testing of stretchable electronics | Ravindranth V. Mahajan, Pramod Malatkar, Steven A. Klein, Vijay Subramania, Aleksandar Aleksov +1 more | 2020-04-28 |
| 10615128 | Systems and methods for electromagnetic interference shielding | Anna M. Prakash, Joshua D. Heppner, Eric J. Li, Nachiket R. Raravikar | 2020-04-07 |
| 10535615 | Electronic package that includes multi-layer stiffener | Manish Dubey, Srikant Nekkanty, Patrick Nardi | 2020-01-14 |
| 10468357 | Stretchable electronics fabrication method with strain redistribution layer | Tatyana N. Andryushchenko, Mauro J. Kobrinsky, Aleksandar Aleksov, David Staines | 2019-11-05 |
| 10461007 | Semiconductor package with electromagnetic interference shielding | Nachiket R. Raravikar | 2019-10-29 |
| 10325866 | Electronic device packages with conformal EMI shielding and related methods | Eric J. Li, Joshua D. Heppner, Mitul Modi | 2019-06-18 |
| 10229887 | Systems and methods for electromagnetic interference shielding | Mitul Modi | 2019-03-12 |
| 10224290 | Electromagnetically shielded electronic devices and related systems and methods | Takashi Kumamoto, Yoshishiro Tomita, Mitul Modi, Joshua D. Heppner, Eric J. Li | 2019-03-05 |
| 10206277 | Gradient encapsulant protection of devices in stretchable electronics | Manish Dubey, Tatyana N. Andryushchenko, Aleksandar Aleksov, David Staines | 2019-02-12 |
| 10192810 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Lars D. Skoglund | 2019-01-29 |
| 9991211 | Semiconductor package having an EMI shielding layer | Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Joshua D. Heppner, Ann Jinyan Xu +2 more | 2018-06-05 |
| 9953929 | Systems and methods for electromagnetic interference shielding | Anna M. Prakash, Joshua D. Heppner, Eric J. Li, Nachiket R. Raravikar | 2018-04-24 |
| 9887104 | Electronic package and method of connecting a first die to a second die to form an electronic package | Manish Dubey, Patrick Nardi, David Woodhams | 2018-02-06 |
| 9847304 | Electronic device packages with conformal EMI shielding and related methods | Eric J. Li, Joshua D. Heppner, Mitul Modi | 2017-12-19 |
| 9786517 | Ablation method and recipe for wafer level underfill material patterning and removal | Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Danish Faruqui, Tyler N. Osborn +2 more | 2017-10-10 |
| 9721906 | Electronic package with corner supports | Manish Dubey, Baris Bicen, Digvijay A. Raorane, Bharat P. Penmecha | 2017-08-01 |
| 9704811 | Perforated conductive material for EMI shielding of semiconductor device and components | Joshua D. Heppner, Mitul Modi, Anna M. Prakash | 2017-07-11 |
| 9685413 | Semiconductor package having an EMI shielding layer | Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Joshua D. Heppner, Ann Jinyan Xu +2 more | 2017-06-20 |
| 9591758 | Flexible electronic system with wire bonds | Aleksandar Aleksov, Mauro J. Kobrinsky, Johanna M. Swan | 2017-03-07 |
| 9508660 | Microelectronic die having chamfered corners | Manish Dubey, Emre Armagan, Lars D. Skoglund | 2016-11-29 |
| 9431274 | Method for reducing underfill filler settling in integrated circuit packages | Suriyakala Ramalingam, Manish Dubey, Hsin-Yu Li, Michelle S. Phen, Hitesh Arora +3 more | 2016-08-30 |
| 9230833 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Manish Dubey, Yonghao Xiu, Arjun Krishnan, Yiqun Bai, Purushotham Kaushik Muthur Srinath | 2016-01-05 |