Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842832 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2017-12-12 |
| 9786517 | Ablation method and recipe for wafer level underfill material patterning and removal | Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Danish Faruqui +2 more | 2017-10-10 |
| 9397071 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2016-07-19 |
| 9312237 | Integrated circuit package with spatially varied solder resist opening dimension | Tieyu Zheng, Sumit Kumar, Sridhar Nara, Renee D. Garcia, Manohar S. Konchady +3 more | 2016-04-12 |
| 9177831 | Die assembly on thin dielectric sheet | Chia-Pin Chiu, Qing Ma, Robert L. Sankman, Paul B. Fischer, Patrick Morrow +2 more | 2015-11-03 |
| 8970051 | Solution to deal with die warpage during 3D die-to-die stacking | Hualiang Shi, Shengquan Ou, Sairam Agraharam | 2015-03-03 |
| 8952532 | Integrated circuit package with spatially varied solder resist opening dimension | Tieyu Zheng, Sumit Kumar, Sridhar Nara, Renee D. Garcia, Manohar S. Konchady +3 more | 2015-02-10 |