Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9859248 | Laser die backside film removal for integrated circuit (IC) packaging | Edward R. Prack, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas, Lars D. Skoglund +3 more | 2018-01-02 |
| 9824991 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Tony Dambrauskas, Mark S. Hlad, Edward R. Prack | 2017-11-21 |
| 9786517 | Ablation method and recipe for wafer level underfill material patterning and removal | Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Tyler N. Osborn +2 more | 2017-10-10 |
| 9583390 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Tony Dambrauskas, Mark S. Hlad, Edward R. Prack | 2017-02-28 |
| 9412702 | Laser die backside film removal for integrated circuit (IC) packaging | Edward R. Prack, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas, Lars D. Skoglund +3 more | 2016-08-09 |
| 9257276 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Tony Dambrauskas, Mark S. Hlad, Edward R. Prack | 2016-02-09 |