Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710646 | Fan-out packaging method and fan-out packaging plate | Chuan Hu, Yingqiang YAN, Yuejin Guo, Yingjun Pi, Junjun Liu | 2023-07-25 |
| 11335664 | Integrated circuit packaging method and integrated packaging circuit | Chuan Hu, Junjun Liu, Yuejin Guo | 2022-05-17 |
| 11183458 | Integrated circuit packaging structure and method | Chuan Hu, Junjun Liu, Yuejin Guo | 2021-11-23 |
| 10930634 | Integrated circuit system and packaging method therefor | Chuan Hu, Junjun Liu, Yuejin Guo | 2021-02-23 |
| 10867959 | Integrated circuit packaging method and integrated packaged circuit | Chuan Hu, Junjun Liu, Yuejin Guo | 2020-12-15 |
| 10615151 | Integrated circuit multichip stacked packaging structure and method | Chuan Hu, Junjun Liu, Yuejin Guo | 2020-04-07 |
| 10573622 | Methods of forming joint structures for surface mount packages | Lilia May | 2020-02-25 |
| 10128225 | Interconnect structures with polymer core | Sandeep Razdan, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson | 2018-11-13 |
| 10068863 | Formation of solder and copper interconnect structures and associated techniques and configurations | — | 2018-09-04 |
| 10049971 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2018-08-14 |
| 9859248 | Laser die backside film removal for integrated circuit (IC) packaging | Danish Faruqui, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas, Lars D. Skoglund +3 more | 2018-01-02 |
| 9824991 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Mark S. Hlad | 2017-11-21 |
| 9786517 | Ablation method and recipe for wafer level underfill material patterning and removal | Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Danish Faruqui, Tyler N. Osborn +2 more | 2017-10-10 |
| 9659889 | Solder-on-die using water-soluble resist system and method | Mihir A. Oka, Xavier Francois Brun, Dingying Xu, Kabirkumar Mirpuri, Saikumar Jayaraman | 2017-05-23 |
| 9613934 | Interconnect structures with polymer core | Sandeep Razdan, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson | 2017-04-04 |
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2017-04-04 |
| 9583390 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Mark S. Hlad | 2017-02-28 |
| 9508667 | Formation of solder and copper interconnect structures and associated techniques and configurations | — | 2016-11-29 |
| 9472517 | Dry-removable protective coatings | Mihir A. Oka, Dingying Xu, Saikumar Jayaraman | 2016-10-18 |
| 9412702 | Laser die backside film removal for integrated circuit (IC) packaging | Danish Faruqui, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas, Lars D. Skoglund +3 more | 2016-08-09 |
| 9257276 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Mark S. Hlad | 2016-02-09 |
| 9165914 | Forming die backside coating structures with coreless packages | Rahul N. Manepalli, Mohit Mamodia, David Xu, Javier Soto Gonzalez | 2015-10-20 |
| 8987918 | Interconnect structures with polymer core | Sandeep Razdan, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson | 2015-03-24 |
| 8674519 | Microelectronic package and method of manufacturing same | Leonel Arana, Robert M. Nickerson | 2014-03-18 |
| 8466559 | Forming die backside coating structures with coreless packages | Rahul N. Manepalli, Mohit Mamodia, Dingying Xu, Javier Soto Gonzalez | 2013-06-18 |