| 11710646 |
Fan-out packaging method and fan-out packaging plate |
Chuan Hu, Yingqiang YAN, Yuejin Guo, Yingjun Pi, Junjun Liu |
2023-07-25 |
|
| 11335664 |
Integrated circuit packaging method and integrated packaging circuit |
Chuan Hu, Junjun Liu, Yuejin Guo |
2022-05-17 |
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| 11183458 |
Integrated circuit packaging structure and method |
Chuan Hu, Junjun Liu, Yuejin Guo |
2021-11-23 |
|
| 10930634 |
Integrated circuit system and packaging method therefor |
Chuan Hu, Junjun Liu, Yuejin Guo |
2021-02-23 |
|
| 10867959 |
Integrated circuit packaging method and integrated packaged circuit |
Chuan Hu, Junjun Liu, Yuejin Guo |
2020-12-15 |
|
| 10615151 |
Integrated circuit multichip stacked packaging structure and method |
Chuan Hu, Junjun Liu, Yuejin Guo |
2020-04-07 |
|
| 10573622 |
Methods of forming joint structures for surface mount packages |
Lilia May |
2020-02-25 |
$18,813,000 |
| 10128225 |
Interconnect structures with polymer core |
Sandeep Razdan, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson |
2018-11-13 |
$26,640,000 |
| 10068863 |
Formation of solder and copper interconnect structures and associated techniques and configurations |
— |
2018-09-04 |
$19,235,000 |
| 10049971 |
Package structure to enhance yield of TMI interconnections |
Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more |
2018-08-14 |
$20,895,000 |
| 9859248 |
Laser die backside film removal for integrated circuit (IC) packaging |
Danish Faruqui, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas, Lars D. Skoglund +3 more |
2018-01-02 |
$11,729,000 |
| 9824991 |
Organic thin film passivation of metal interconnections |
Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Mark S. Hlad |
2017-11-21 |
$11,290,000 |
| 9786517 |
Ablation method and recipe for wafer level underfill material patterning and removal |
Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Danish Faruqui, Tyler N. Osborn +2 more |
2017-10-10 |
$9,084,000 |
| 9659889 |
Solder-on-die using water-soluble resist system and method |
Mihir A. Oka, Xavier Francois Brun, Dingying Xu, Kabirkumar Mirpuri, Saikumar Jayaraman |
2017-05-23 |
$7,972,000 |
| 9613934 |
Interconnect structures with polymer core |
Sandeep Razdan, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson |
2017-04-04 |
$8,141,000 |
| 9613933 |
Package structure to enhance yield of TMI interconnections |
Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more |
2017-04-04 |
$8,141,000 |
| 9583390 |
Organic thin film passivation of metal interconnections |
Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Mark S. Hlad |
2017-02-28 |
$9,011,000 |
| 9508667 |
Formation of solder and copper interconnect structures and associated techniques and configurations |
— |
2016-11-29 |
$9,403,000 |
| 9472517 |
Dry-removable protective coatings |
Mihir A. Oka, Dingying Xu, Saikumar Jayaraman |
2016-10-18 |
$9,528,000 |
| 9412702 |
Laser die backside film removal for integrated circuit (IC) packaging |
Danish Faruqui, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas, Lars D. Skoglund +3 more |
2016-08-09 |
$12,367,000 |
| 9257276 |
Organic thin film passivation of metal interconnections |
Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Mark S. Hlad |
2016-02-09 |
$15,927,000 |
| 9165914 |
Forming die backside coating structures with coreless packages |
Rahul N. Manepalli, Mohit Mamodia, David Xu, Javier Soto Gonzalez |
2015-10-20 |
$14,675,000 |
| 8987918 |
Interconnect structures with polymer core |
Sandeep Razdan, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson |
2015-03-24 |
$15,411,000 |
| 8674519 |
Microelectronic package and method of manufacturing same |
Leonel Arana, Robert M. Nickerson |
2014-03-18 |
$15,232,000 |
| 8466559 |
Forming die backside coating structures with coreless packages |
Rahul N. Manepalli, Mohit Mamodia, Dingying Xu, Javier Soto Gonzalez |
2013-06-18 |
$21,688,000 |
