Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176318 | Thermal compression bonder nozzle with vacuum relief features | Kartik Srinivasan, Wei Tan, James Mellody | 2024-12-24 |
| 11652080 | Thermal compression bonder nozzle with vacuum relief features | Kartik Srinivasan, Wei Tan, James Mellody | 2023-05-16 |
| 10546823 | Apparatus and method for mitigating surface imperfections on die backside film using fluorocarbon material | Balu Pathangey, Andrew Proctor | 2020-01-28 |
| 10515914 | Sintered solder for fine pitch first-level interconnect (FLI) applications | Ken Hackenberg, Vijay Krishnan SUBRAMANIAN, Neha M. Patel, Nachiket R. Raravikar | 2019-12-24 |
| 10224299 | Sintered solder for fine pitch first-level interconnect (FLI) applications | Ken Hackenberg, Vijay Krishnan SUBRAMANIAN, Neha M. Patel, Nachiket R. Raravikar | 2019-03-05 |
| 9859248 | Laser die backside film removal for integrated circuit (IC) packaging | Danish Faruqui, Edward R. Prack, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas +3 more | 2018-01-02 |
| 9659889 | Solder-on-die using water-soluble resist system and method | Xavier Francois Brun, Dingying Xu, Edward R. Prack, Kabirkumar Mirpuri, Saikumar Jayaraman | 2017-05-23 |
| 9530718 | DBF film as a thermal interface material | Hitesh Arora, Chandra Mohan Jha | 2016-12-27 |
| 9472517 | Dry-removable protective coatings | Edward R. Prack, Dingying Xu, Saikumar Jayaraman | 2016-10-18 |
| 9412702 | Laser die backside film removal for integrated circuit (IC) packaging | Danish Faruqui, Edward R. Prack, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas +3 more | 2016-08-09 |