Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176318 | Thermal compression bonder nozzle with vacuum relief features | Mihir A. Oka, Kartik Srinivasan, James Mellody | 2024-12-24 |
| 11652080 | Thermal compression bonder nozzle with vacuum relief features | Mihir A. Oka, Kartik Srinivasan, James Mellody | 2023-05-16 |
| 8895365 | Techniques and configurations for surface treatment of an integrated circuit substrate | Suriyakala Ramalingam, Rajen S. Sidhu, Nisha Ananthakrishnan, Sivakumar Nagarajan, Sandeep Razdan +1 more | 2014-11-25 |