Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176318 | Thermal compression bonder nozzle with vacuum relief features | Mihir A. Oka, Kartik Srinivasan, Wei Tan | 2024-12-24 |
| 11652080 | Thermal compression bonder nozzle with vacuum relief features | Mihir A. Oka, Kartik Srinivasan, Wei Tan | 2023-05-16 |
| 8987894 | Underfill process and materials for singulated heat spreader stiffener for thin core panel processing | Sabina J. Houle | 2015-03-24 |
| 8765528 | Underfill process and materials for singulated heat spreader stiffener for thin core panel processing | Sabina J. Houle | 2014-07-01 |
| 8390112 | Underfill process and materials for singulated heat spreader stiffener for thin core panel processing | Sabina J. Houle | 2013-03-05 |
| 8163598 | Clipless integrated heat spreader process and materials | George Kostiew, Raj Bahadur, George Vakanas, Leonel Arana | 2012-04-24 |
| 8067256 | Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the method | Sabina J. Houle | 2011-11-29 |
| 7892883 | Clipless integrated heat spreader process and materials | George Kostiew, Raj Bahadur, George Vakanas, Leonel Arana | 2011-02-22 |
| 7364943 | Method of bonding a microelectronic die to a substrate and arrangement to carry out method | Sabina J. Houle | 2008-04-29 |