Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272614 | Integrated circuit packages with solder thermal interface materials with embedded particles | Amitesh Saha, Sergio Antonio Chan Arguedas, Marco Aurelio Cartas, Peng Li | 2025-04-08 |
| 12062592 | Integrated circuit packages with thermal interface materials with different material compositions | Sergio Antonio Chan Arguedas, Amitesh Saha, Marco Aurelio Cartas, Emilio Tarango Valles | 2024-08-13 |
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more | 2023-11-28 |
| 11798861 | Integrated heat spreader (IHS) with heating element | Peng Li, Kelly Lofgreen, Manish Dubey, Bamidele Daniel Falola, Shenavia S. Howell +3 more | 2023-10-24 |
| 11791237 | Microelectronic assemblies including a thermal interface material | Peng Li, Sergio Antonio Chan Arguedas, Yongmei Liu, Deepak Goyal | 2023-10-17 |
| 11710677 | Ultraviolet (UV)-curable sealant in a microelectronic package | Taylor Gaines, Elah Bozorg-Grayeli | 2023-07-25 |
| 11710672 | Microelectronic package with underfilled sealant | Taylor Gaines, Frederick Atadana, Elah Bozorg-Grayeli | 2023-07-25 |
| 11404349 | Multi-chip packages and sinterable paste for use with thermal interface materials | Nachiket R. Raravikar, Ravindranath V. Mahajan, Robert L. Sankman, James C. Matayabas, Jr., Nayandeep K. Mahanta +1 more | 2022-08-02 |
| 10515914 | Sintered solder for fine pitch first-level interconnect (FLI) applications | Mihir A. Oka, Vijay Krishnan SUBRAMANIAN, Neha M. Patel, Nachiket R. Raravikar | 2019-12-24 |
| 10224299 | Sintered solder for fine pitch first-level interconnect (FLI) applications | Mihir A. Oka, Vijay Krishnan SUBRAMANIAN, Neha M. Patel, Nachiket R. Raravikar | 2019-03-05 |