Ken Hackenberg — 10 Patents at Intel

Ken Hackenberg has been granted 10 US patents while listed as an inventor at Intel. The first was granted in 2019 and the most recent in April 2025. Ken Hackenberg ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Ken Hackenberg in Plano, TX, US.

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12272614	Integrated circuit packages with solder thermal interface materials with embedded particles	Amitesh Saha, Sergio Antonio Chan Arguedas, Marco Aurelio Cartas, Peng Li	2025-04-08
12062592	Integrated circuit packages with thermal interface materials with different material compositions	Sergio Antonio Chan Arguedas, Amitesh Saha, Marco Aurelio Cartas, Emilio Tarango Valles	2024-08-13	$26,861,000
11832419	Full package vapor chamber with IHS	Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more	2023-11-28	$31,872,000
11798861	Integrated heat spreader (IHS) with heating element	Peng Li, Kelly Lofgreen, Manish Dubey, Bamidele Daniel Falola, Shenavia S. Howell +3 more	2023-10-24	$20,059,000
11791237	Microelectronic assemblies including a thermal interface material	Peng Li, Sergio Antonio Chan Arguedas, Yongmei Liu, Deepak Goyal	2023-10-17	$15,641,000
11710677	Ultraviolet (UV)-curable sealant in a microelectronic package	Taylor Gaines, Elah Bozorg-Grayeli	2023-07-25	$28,608,000
11710672	Microelectronic package with underfilled sealant	Taylor Gaines, Frederick Atadana, Elah Bozorg-Grayeli	2023-07-25	$28,608,000
11404349	Multi-chip packages and sinterable paste for use with thermal interface materials	Nachiket R. Raravikar, Ravindranath V. Mahajan, Robert L. Sankman, James C. Matayabas, Jr., Nayandeep K. Mahanta +1 more	2022-08-02	$13,520,000
10515914	Sintered solder for fine pitch first-level interconnect (FLI) applications	Mihir A. Oka, Vijay Krishnan SUBRAMANIAN, Neha M. Patel, Nachiket R. Raravikar	2019-12-24	$26,956,000
10224299	Sintered solder for fine pitch first-level interconnect (FLI) applications	Mihir A. Oka, Vijay Krishnan SUBRAMANIAN, Neha M. Patel, Nachiket R. Raravikar	2019-03-05	$19,977,000

Ken Hackenberg — 10 Patents

Issued Patents All Time

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