Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272614 | Integrated circuit packages with solder thermal interface materials with embedded particles | Sergio Antonio Chan Arguedas, Marco Aurelio Cartas, Ken Hackenberg, Peng Li | 2025-04-08 |
| 12166004 | Solder thermal interface material (STIM) with dopant | Susmriti Das Mahapatra, Bamidele Daniel Falola, Peng Li | 2024-12-10 |
| 12062592 | Integrated circuit packages with thermal interface materials with different material compositions | Sergio Antonio Chan Arguedas, Marco Aurelio Cartas, Ken Hackenberg, Emilio Tarango Valles | 2024-08-13 |
| 11817369 | Lids for integrated circuit packages with solder thermal interface materials | Bamidele Daniel Falola, Susmriti Das Mahapatra, Sergio Antonio Chan Arguedas, Peng Li | 2023-11-14 |
| 11670569 | Channeled lids for integrated circuit packages | Manish Dubey, Marco Aurelio Cartas, Peng Li, Bamidele Daniel Falola | 2023-06-06 |
| 11551997 | Thermal management solutions using self-healing polymeric thermal interface materials | Shushan Gong, Shrenik Kothari | 2023-01-10 |