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Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Shrenik Kothari — 7 Patents

Intel: 7 patents #5,443 of 30,777Top 20%
Phoenix, AZ: #963 of 6,660 inventorsTop 15%
Arizona: #5,272 of 32,909 inventorsTop 20%
Overall (All Time): #680,018 of 4,157,543Top 20%
7 Patents All Time
Shrenik Kothari has been granted 7 US patents while listed as an inventor at Intel. The first was granted in 2016 and the most recent in June 2025. Shrenik Kothari ranks #680,018 of 4,157,543 US inventors in our database (top 16.4%). Patent records list Shrenik Kothari in Phoenix, AZ, US.

Patents per Year

Patents granted per year, 2016 to 2025Bar chart with a peak of 2 patents in 2022.peak 22016: 1 patents20162022: 2 patents20222023: 2 patents20232024: 1 patents20242025: 1 patents2025

Issued Patents All Time

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12341080 Semiconductor device stack-up with bulk substrate material to mitigate hot spots Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon 2025-06-24
11978689 Semiconductor device stack-up with bulk substrate material to mitigate hot spots Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon 2024-05-07 $26,756,000
11756860 Semiconductor device stack-up with bulk substrate material to mitigate hot spots Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon 2023-09-12 $19,004,000
11551997 Thermal management solutions using self-healing polymeric thermal interface materials Amitesh Saha, Shushan Gong 2023-01-10 $14,061,000
11495518 Multi-surface heat sink suitable for multi-chip packages Sandeep Ahuja, Susan F. Smith, Jeffory L. Smalley, Francisco Gabriel Lozano Sanchez, Maria de la Luz Belmont Velazquez +5 more 2022-11-08 $15,080,000
11398414 Sloped metal features for cooling hotspots in stacked-die packages Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Joe Walczyk, Chandra Mohan Jha +2 more 2022-07-26 $27,041,000
9515003 Embedded air core inductors for integrated circuit package substrates with thermal conductor Thomas J. Fitzgerald, William J. Lambert, Punita Sullhan, Aravindha R. Antoniswamy 2016-12-06 $8,381,000