Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341080 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon | 2025-06-24 |
| 11978689 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon | 2024-05-07 |
| 11756860 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon | 2023-09-12 |
| 11551997 | Thermal management solutions using self-healing polymeric thermal interface materials | Amitesh Saha, Shushan Gong | 2023-01-10 |
| 11495518 | Multi-surface heat sink suitable for multi-chip packages | Sandeep Ahuja, Susan F. Smith, Jeffory L. Smalley, Francisco Gabriel Lozano Sanchez, Maria de la Luz Belmont Velazquez +5 more | 2022-11-08 |
| 11398414 | Sloped metal features for cooling hotspots in stacked-die packages | Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Joe Walczyk, Chandra Mohan Jha +2 more | 2022-07-26 |
| 9515003 | Embedded air core inductors for integrated circuit package substrates with thermal conductor | Thomas J. Fitzgerald, William J. Lambert, Punita Sullhan, Aravindha R. Antoniswamy | 2016-12-06 |