| 12476400 |
Power card edge connector with improved power terminals |
Mingji Xu, Teng Qin, Xue-Wu Bu, Huafeng Yu |
2025-11-18 |
|
| 12341080 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Chandra Mohan Jha, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon |
2025-06-24 |
|
| 12021016 |
Thermally enhanced silicon back end layers for improved thermal performance |
Chandra Mohan Jha, Pooya Tadayon, Aastha Uppal, Paul Diglio, Xavier Francois Brun |
2024-06-25 |
$22,163,000 |
| 11978689 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Chandra Mohan Jha, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon |
2024-05-07 |
$26,756,000 |
| 11948906 |
Hybrid backside thermal structures for enhanced IC packages |
Feras Eid, Joe Walczyk, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala |
2024-04-02 |
$34,819,000 |
| 11756856 |
Package architecture including thermoelectric cooler structures |
Krishna Vasanth Valavala, Ravindranath V. Mahajan, Chandra Mohan Jha, Kelly Lofgreen |
2023-09-12 |
$19,004,000 |
| 11756860 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Chandra Mohan Jha, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon |
2023-09-12 |
$19,004,000 |
| 11676883 |
Thermoelectric coolers combined with phase-change material in integrated circuit packages |
Javed Shaikh, Je-Young Chang, Kelly Lofgreen, Aastha Uppal |
2023-06-13 |
$22,204,000 |
| 11664294 |
Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies |
Aastha Uppal, Je-Young Chang, Minseok Ha |
2023-05-30 |
$16,378,000 |
| 11626395 |
Thermal spreading management of 3D stacked integrated circuits |
Robert L. Sankman, Pooya Tadayon, Chandra Mohan Jha, Zhimin Wan |
2023-04-11 |
$27,486,000 |
| 11574851 |
Coupled cooling fins in ultra-small systems |
Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Nitin A. Deshpande +6 more |
2023-02-07 |
$11,877,000 |
| 11444003 |
Integrated heat spreader with multiple channels for multichip packages |
Zhimin Wan, Chia-Pin Chiu, Chandra Mohan Jha, Shankar Devasenathipathy |
2022-09-13 |
$14,653,000 |
| 11398414 |
Sloped metal features for cooling hotspots in stacked-die packages |
Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Joe Walczyk, Chandra Mohan Jha +2 more |
2022-07-26 |
$27,041,000 |
| 11374605 |
Self-diagnosis system for wireless transceivers with multiple antennas |
— |
2022-06-28 |
$34,210,000 |
| 11127727 |
Thermal spreading management of 3D stacked integrated circuits |
Robert L. Sankman, Pooya Tadayon, Chandra Mohan Jha, Zhimin Wan |
2021-09-21 |
$30,488,000 |
| 9608844 |
System and method for performing channel estimation on an OFDM signal |
Semih Serbetli |
2017-03-28 |
$7,034,000 |
| 9071492 |
Reduced latency channel-estimation |
Arie Geert Cornelis Koppelaar |
2015-06-30 |
$16,077,000 |
| 8920934 |
Hybrid solder and filled paste in microelectronic packaging |
Hongjin Jiang, Arun Kumar C. Nallani, Rajen S. Sidhu, Martha A. Dudek |
2014-12-30 |
$18,984,000 |
| 8904266 |
Multi-standard viterbi processor |
Nur Engin, Frits Anthonie Steenhof, Marc Klaassen, Andries Pieter Hekstra, Sergie Valerjewitsch Sawitzki |
2014-12-02 |
$11,825,000 |
| 8566683 |
Power-reduced preliminary decoded bits in viterbi decoders |
Andries Pieter Hekstra |
2013-10-22 |
$6,223,000 |
