Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9960105 | Controlled solder height packages and assembly processes | Hongin Jiang, Wei Tan | 2018-05-01 |
| 8920934 | Hybrid solder and filled paste in microelectronic packaging | Hongjin Jiang, Rajen S. Sidhu, Martha A. Dudek, Weihua Tang | 2014-12-30 |
| 7096568 | Method of manufacturing a microcomponent assembly | Erik Nilsen, Matthew D. Ellis, Charles L. Goldsmith, Jeong Bong Lee, Xiaojun Huang +2 more | 2006-08-29 |