Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9950393 | Hybrid low metal loading flux | Rajen S. Sidhu, James C. Matayabas, Jr., Michelle S. Phen, Wei Tan | 2018-04-24 |
| 9283641 | Flux materials for heated solder placement and associated techniques and configurations | Rajen S. Sidhu, Wei Tan | 2016-03-15 |
| 9257405 | Multi-solder techniques and configurations for integrated circuit package assembly | Rajen S. Sidhu, Wei Hu, Carl Deppisch | 2016-02-09 |
| 9024453 | Functional material systems and processes for package-level interconnects | Rajen S. Sidhu, Ashay Dani | 2015-05-05 |
| 8920934 | Hybrid solder and filled paste in microelectronic packaging | Hongjin Jiang, Arun Kumar C. Nallani, Rajen S. Sidhu, Weihua Tang | 2014-12-30 |
| 8809181 | Multi-solder techniques and configurations for integrated circuit package assembly | Rajen S. Sidhu, Wei Hu, Carl Deppisch | 2014-08-19 |
| 8530058 | Oxidation resistant Pb-free solder alloys | Nikhilesh Chawla | 2013-09-10 |