| 11335616 |
Substrate integrated inductor with composite magnetic resin layer |
Malavarayan Sankarasubramanian, Yongki Min, Kaladhar Radhakrishnan |
2022-05-17 |
$14,251,000 |
| 10049971 |
Package structure to enhance yield of TMI interconnections |
Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Edward R. Prack +6 more |
2018-08-14 |
$20,895,000 |
| 9613933 |
Package structure to enhance yield of TMI interconnections |
Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Edward R. Prack +6 more |
2017-04-04 |
$8,141,000 |
| 9247686 |
Polymer matrices for polymer solder hybrid materials |
Saikumar Jayaraman, Paul A. Koning |
2016-01-26 |
$9,792,000 |
| 9024453 |
Functional material systems and processes for package-level interconnects |
Rajen S. Sidhu, Martha A. Dudek |
2015-05-05 |
$18,811,000 |
| 8701281 |
Substrate metallization and ball attach metallurgy with a novel dopant element |
Rajen S. Sidhu, Mukul Renavikar |
2014-04-22 |
$10,911,000 |
| 8703286 |
Polymer matrices for polymer solder hybrid materials |
Saikumar Jayaraman, Paul A. Koning |
2014-04-22 |
$10,911,000 |
| 7996989 |
Heat dissipating device with preselected designed interface for thermal interface materials |
Sabina J. Houle, Christopher L. Rumer, Thomas J. Fitzgerald |
2011-08-16 |
$18,060,000 |
| 7967942 |
Polymer matrices for polymer solder hybrid materials |
Saikumar Jayaraman, Paul A. Koning |
2011-06-28 |
$18,630,000 |
| 7960019 |
Phase change material containing fusible particles as thermally conductive filler |
Salkumar Jayaraman, Paul A. Koning |
2011-06-14 |
$17,389,000 |
| 7846778 |
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
Christopher L. Rumer, Sabina J. Houle, Saikumar Jayaraman, Paul A. Koning |
2010-12-07 |
$26,454,000 |
| 7776657 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same |
Anna M. Prakash, Saikumar Jayaraman, Mitesh Patel, Vijay Wakharkar |
2010-08-17 |
$11,574,000 |
| 7727815 |
Reactive gettering in phase change solders to inhibit oxidation at contact surfaces |
Chad A. Kumaus, Carl Deppisch, Daewoong Suh |
2010-06-01 |
$13,475,000 |
| 7527090 |
Heat dissipating device with preselected designed interface for thermal interface materials |
Sabina J. Houle, Christopher L. Rumer, Thomas J. Fitzgerald |
2009-05-05 |
$25,050,000 |
| 7473995 |
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
Christopher L. Rumer, Sabina J. Houle, Saikumar Jayaraman, Paul A. Koning |
2009-01-06 |
$21,219,000 |
| 7332807 |
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same |
Anna M. Prakash, Saikumar Jayaraman, Mitesh Patel, Vijay Wakharkar |
2008-02-19 |
$15,849,000 |
| 7311967 |
Thermal interface material and electronic assembly having such a thermal interface material |
Paul A. Koning, Saikumar Jayaraman, Christopher L. Rumer |
2007-12-25 |
|
| 7294394 |
Phase change material containing fusible particles as thermally conductive filler |
Saikumar Jayaraman, Paul A. Koning |
2007-11-13 |
$26,433,000 |
| 7252877 |
Polymer matrices for polymer solder hybrid materials |
Saikumar Jayaraman, Paul A. Koning |
2007-08-07 |
$27,562,000 |
| 7253523 |
Reworkable thermal interface material |
Scott Gilbert, Ajit Sathe, Ravi Prasher |
2007-08-07 |
$27,562,000 |
| 7030483 |
Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application |
James C. Matayabas, Jr. |
2006-04-18 |
$13,047,000 |
| 7014093 |
Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
Sabina J. Houle |
2006-03-21 |
$17,683,000 |
| 6974723 |
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials |
James C. Matayabas, Jr., Paul A. Koning, Christopher L. Rumer |
2005-12-13 |
$11,810,000 |
| 6974726 |
Silicon wafer with soluble protective coating |
Gudbjorg H. Oskarsdottir, Chris Matayabas, Sujit Sharan, Chris Rumer, Beverly J. Canham |
2005-12-13 |
$11,810,000 |
| 6926955 |
Phase change material containing fusible particles as thermally conductive filler |
Saikumar Jayaraman, Paul A. Koning |
2005-08-09 |
$18,014,000 |
