Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335616 | Substrate integrated inductor with composite magnetic resin layer | Malavarayan Sankarasubramanian, Yongki Min, Kaladhar Radhakrishnan | 2022-05-17 |
| 10049971 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Edward R. Prack +6 more | 2018-08-14 |
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Edward R. Prack +6 more | 2017-04-04 |
| 9247686 | Polymer matrices for polymer solder hybrid materials | Saikumar Jayaraman, Paul A. Koning | 2016-01-26 |
| 9024453 | Functional material systems and processes for package-level interconnects | Rajen S. Sidhu, Martha A. Dudek | 2015-05-05 |
| 8701281 | Substrate metallization and ball attach metallurgy with a novel dopant element | Rajen S. Sidhu, Mukul Renavikar | 2014-04-22 |
| 8703286 | Polymer matrices for polymer solder hybrid materials | Saikumar Jayaraman, Paul A. Koning | 2014-04-22 |
| 7996989 | Heat dissipating device with preselected designed interface for thermal interface materials | Sabina J. Houle, Christopher L. Rumer, Thomas J. Fitzgerald | 2011-08-16 |
| 7967942 | Polymer matrices for polymer solder hybrid materials | Saikumar Jayaraman, Paul A. Koning | 2011-06-28 |
| 7960019 | Phase change material containing fusible particles as thermally conductive filler | Salkumar Jayaraman, Paul A. Koning | 2011-06-14 |
| 7846778 | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | Christopher L. Rumer, Sabina J. Houle, Saikumar Jayaraman, Paul A. Koning | 2010-12-07 |
| 7776657 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same | Anna M. Prakash, Saikumar Jayaraman, Mitesh Patel, Vijay Wakharkar | 2010-08-17 |
| 7727815 | Reactive gettering in phase change solders to inhibit oxidation at contact surfaces | Chad A. Kumaus, Carl Deppisch, Daewoong Suh | 2010-06-01 |
| 7527090 | Heat dissipating device with preselected designed interface for thermal interface materials | Sabina J. Houle, Christopher L. Rumer, Thomas J. Fitzgerald | 2009-05-05 |
| 7473995 | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | Christopher L. Rumer, Sabina J. Houle, Saikumar Jayaraman, Paul A. Koning | 2009-01-06 |
| 7332807 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same | Anna M. Prakash, Saikumar Jayaraman, Mitesh Patel, Vijay Wakharkar | 2008-02-19 |
| 7311967 | Thermal interface material and electronic assembly having such a thermal interface material | Paul A. Koning, Saikumar Jayaraman, Christopher L. Rumer | 2007-12-25 |
| 7294394 | Phase change material containing fusible particles as thermally conductive filler | Saikumar Jayaraman, Paul A. Koning | 2007-11-13 |
| 7252877 | Polymer matrices for polymer solder hybrid materials | Saikumar Jayaraman, Paul A. Koning | 2007-08-07 |
| 7253523 | Reworkable thermal interface material | Scott Gilbert, Ajit Sathe, Ravi Prasher | 2007-08-07 |
| 7030483 | Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application | James C. Matayabas, Jr. | 2006-04-18 |
| 7014093 | Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same | Sabina J. Houle | 2006-03-21 |
| 6974723 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | James C. Matayabas, Jr., Paul A. Koning, Christopher L. Rumer | 2005-12-13 |
| 6974726 | Silicon wafer with soluble protective coating | Gudbjorg H. Oskarsdottir, Chris Matayabas, Sujit Sharan, Chris Rumer, Beverly J. Canham | 2005-12-13 |
| 6926955 | Phase change material containing fusible particles as thermally conductive filler | Saikumar Jayaraman, Paul A. Koning | 2005-08-09 |