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Integrated circuit package having bottom-side stiffener |
Mat J. Manusharow, Tong Wa Chao |
2015-02-10 |
| 7589395 |
Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation |
Mathew J. Manusharow, Sung Won Moon |
2009-09-15 |
| 7253523 |
Reworkable thermal interface material |
Ashay Dani, Scott Gilbert, Ravi Prasher |
2007-08-07 |
| 7159313 |
Solderless electronics packaging and methods of manufacture |
Paul H. Wermer |
2007-01-09 |
| 7045890 |
Heat spreader and stiffener having a stiffener extension |
Hong Xie, Kristopher Frutschy, Koushik Banerjee |
2006-05-16 |
| 6903278 |
Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate |
— |
2005-06-07 |
| 6840777 |
Solderless electronics packaging |
Paul H. Wermer |
2005-01-11 |
| 6800947 |
Flexible tape electronics packaging |
— |
2004-10-05 |
| 6703697 |
Electronic package design with improved power delivery performance |
Anne Leahy |
2004-03-09 |
| 6661660 |
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
Ravi Prasher, Abhay Watwe, Gregory M. Chrysler, Kristopher Frutschy, Leo Ofman |
2003-12-09 |
| 6639799 |
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
Ravi Prasher, Abhay Watwe, Gregory M. Chrysler, Kristopher Frutschy, Leo Ofman |
2003-10-28 |
| 6625022 |
Direct heatpipe attachment to die using center point loading |
Kris Frutschy, Ravi Prasher, Eric Distefano |
2003-09-23 |
| 6535386 |
Electronic assembly having a heat pipe that conducts heat from a semiconductor die |
Michael J. Witherspoon, Ravi Prasher, Kristopher Frutschy |
2003-03-18 |
| 6469893 |
Direct heatpipe attachment to die using center point loading |
Kris Frutschy, Ravi Prasher, Eric Distefano |
2002-10-22 |