Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8952511 | Integrated circuit package having bottom-side stiffener | Mat J. Manusharow, Tong Wa Chao | 2015-02-10 |
| 7589395 | Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation | Mathew J. Manusharow, Sung Won Moon | 2009-09-15 |
| 7253523 | Reworkable thermal interface material | Ashay Dani, Scott Gilbert, Ravi Prasher | 2007-08-07 |
| 7159313 | Solderless electronics packaging and methods of manufacture | Paul H. Wermer | 2007-01-09 |
| 7045890 | Heat spreader and stiffener having a stiffener extension | Hong Xie, Kristopher Frutschy, Koushik Banerjee | 2006-05-16 |
| 6903278 | Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate | — | 2005-06-07 |
| 6840777 | Solderless electronics packaging | Paul H. Wermer | 2005-01-11 |
| 6800947 | Flexible tape electronics packaging | — | 2004-10-05 |
| 6703697 | Electronic package design with improved power delivery performance | Anne Leahy | 2004-03-09 |
| 6661660 | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment | Ravi Prasher, Abhay Watwe, Gregory M. Chrysler, Kristopher Frutschy, Leo Ofman | 2003-12-09 |
| 6639799 | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment | Ravi Prasher, Abhay Watwe, Gregory M. Chrysler, Kristopher Frutschy, Leo Ofman | 2003-10-28 |
| 6625022 | Direct heatpipe attachment to die using center point loading | Kris Frutschy, Ravi Prasher, Eric Distefano | 2003-09-23 |
| 6535386 | Electronic assembly having a heat pipe that conducts heat from a semiconductor die | Michael J. Witherspoon, Ravi Prasher, Kristopher Frutschy | 2003-03-18 |
| 6469893 | Direct heatpipe attachment to die using center point loading | Kris Frutschy, Ravi Prasher, Eric Distefano | 2002-10-22 |