LO

Leo Ofman

IN Intel: 5 patents #7,174 of 30,777Top 25%
Motorola: 1 patents #6,475 of 12,470Top 55%
Overall (All Time): #875,989 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7096580 I/C package/thermal-solution retention mechanism with spring effect Carlos Gonzalez 2006-08-29
6884943 I/C package/ thermal-solution retention mechanism with spring effect Carlos Gonzalez 2005-04-26
6661660 Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment Ravi Prasher, Abhay Watwe, Gregory M. Chrysler, Kristopher Frutschy, Ajit Sathe 2003-12-09
6657131 I/C package / thermal-solution retention mechanism with spring effect Carlos Gonzalez 2003-12-02
6639799 Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment Ravi Prasher, Abhay Watwe, Gregory M. Chrysler, Kristopher Frutschy, Ajit Sathe 2003-10-28
4589547 Carrier for stacked semiconductor die Timothy C. Stewart, Kelvin R. Blair, Randolph M. Gregg 1986-05-20