Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Carlos Gonzalez — 23 Patents

Intel: 14 patents #2,935 of 30,777Top 10%
DIDirectv: 3 patents #225 of 679Top 35%
SFState Farm: 2 patents #623 of 1,137Top 55%
Eastman Kodak: 1 patents #4,972 of 8,114Top 65%
Miami, FL: #84 of 4,605 inventorsTop 2%
Florida: #1,938 of 67,251 inventorsTop 3%
Overall (All Time): #178,160 of 4,157,543Top 5%
23 Patents All Time
Carlos Gonzalez has been granted 23 US patents while listed as an inventor at Intel. The first was granted in 1998 and the most recent in October 2024. Carlos Gonzalez ranks #178,160 of 4,157,543 US inventors in our database (top 4.3%). Patent records list Carlos Gonzalez in Miami, FL, US.

Issued Patents All Time

Showing 1–23 of 23 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12117893 Error documentation assistance Javier Lozano, William Luo, Bing (Aaron) Lin 2024-10-15
11693726 Error documentation assistance Javier Lozano, William Luo, Bing (Aaron) Lin 2023-07-04
D768350 Cash storing apparatus 2016-10-04
D726813 Cash count audit apparatus 2015-04-14
8666941 System and method for persistent storage of common user information for interactive television using a centrally located repository Steven Soloff, Edward P. Jurado 2014-03-04 $167,661,000
8138916 Counterfeit detection system and method of utilizing same 2012-03-20
7844994 System and method for persistent storage of common user information for interactive television using a centrally located repository Steven Soloff, Edward P. Jurado 2010-11-30 $63,519,000
7793324 System for obtaining data regarding customer use of interactive television Derek P. Footer, Angela M. Trujillo, Narda J. Laverde 2010-09-07 $164,042,000
7498678 Electronic assemblies and systems with filled no-flow underfill Song Shi, Milan Djukic 2009-03-03 $13,073,000
7323360 Electronic assemblies with filled no-flow underfill Song Shi, Milan Djukic 2008-01-29 $16,660,000
7235886 Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby Biju Chandran 2007-06-26 $20,503,000
7199342 Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy Glenn Ratificar, Lejun Wang 2007-04-03 $17,128,000
7122403 Method of interconnecting die and substrate Biju Chandran 2006-10-17 $12,433,000
7096580 I/C package/thermal-solution retention mechanism with spring effect Leo Ofman 2006-08-29 $13,270,000
6884943 I/C package/ thermal-solution retention mechanism with spring effect Leo Ofman 2005-04-26 $30,166,000
6752634 Contact array for semiconductor package Biju Chandran 2004-06-22 $27,859,000
6750551 Direct BGA attachment without solder reflow Kristopher Frutschy, Charles A. Gealer 2004-06-15 $34,603,000
6750549 Variable pad diameter on the land side for improving the co-planarity of ball grid array packages Biju Chandran 2004-06-15 $34,603,000
6672892 Package retention module coupled directly to a socket Biju Chandran 2004-01-06 $43,851,000
6657131 I/C package / thermal-solution retention mechanism with spring effect Leo Ofman 2003-12-02 $54,763,000
6644536 Solder reflow with microwave energy Glenn Ratificar, Lejun Wang 2003-11-11 $43,556,000
6600652 Package retention module coupled directly to a socket Biju Chandran 2003-07-29 $49,479,000
5771056 Digital image reproduction system including a programmable sorter Steven Cook 1998-06-23 $14,890,000