Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12117893 | Error documentation assistance | Javier Lozano, William Luo, Bing (Aaron) Lin | 2024-10-15 |
| 11693726 | Error documentation assistance | Javier Lozano, William Luo, Bing (Aaron) Lin | 2023-07-04 |
| D768350 | Cash storing apparatus | — | 2016-10-04 |
| D726813 | Cash count audit apparatus | — | 2015-04-14 |
| 8666941 | System and method for persistent storage of common user information for interactive television using a centrally located repository | Steven Soloff, Edward P. Jurado | 2014-03-04 |
| 8138916 | Counterfeit detection system and method of utilizing same | — | 2012-03-20 |
| 7844994 | System and method for persistent storage of common user information for interactive television using a centrally located repository | Steven Soloff, Edward P. Jurado | 2010-11-30 |
| 7793324 | System for obtaining data regarding customer use of interactive television | Derek P. Footer, Angela M. Trujillo, Narda J. Laverde | 2010-09-07 |
| 7498678 | Electronic assemblies and systems with filled no-flow underfill | Song Shi, Milan Djukic | 2009-03-03 |
| 7323360 | Electronic assemblies with filled no-flow underfill | Song Shi, Milan Djukic | 2008-01-29 |
| 7235886 | Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby | Biju Chandran | 2007-06-26 |
| 7199342 | Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy | Glenn Ratificar, Lejun Wang | 2007-04-03 |
| 7122403 | Method of interconnecting die and substrate | Biju Chandran | 2006-10-17 |
| 7096580 | I/C package/thermal-solution retention mechanism with spring effect | Leo Ofman | 2006-08-29 |
| 6884943 | I/C package/ thermal-solution retention mechanism with spring effect | Leo Ofman | 2005-04-26 |
| 6752634 | Contact array for semiconductor package | Biju Chandran | 2004-06-22 |
| 6750551 | Direct BGA attachment without solder reflow | Kristopher Frutschy, Charles A. Gealer | 2004-06-15 |
| 6750549 | Variable pad diameter on the land side for improving the co-planarity of ball grid array packages | Biju Chandran | 2004-06-15 |
| 6672892 | Package retention module coupled directly to a socket | Biju Chandran | 2004-01-06 |
| 6657131 | I/C package / thermal-solution retention mechanism with spring effect | Leo Ofman | 2003-12-02 |
| 6644536 | Solder reflow with microwave energy | Glenn Ratificar, Lejun Wang | 2003-11-11 |
| 6600652 | Package retention module coupled directly to a socket | Biju Chandran | 2003-07-29 |
| 5771056 | Digital image reproduction system including a programmable sorter | Steven Cook | 1998-06-23 |