Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7199342 | Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy | Carlos Gonzalez, Lejun Wang | 2007-04-03 | $17,128,000 |
| 6644536 | Solder reflow with microwave energy | Carlos Gonzalez, Lejun Wang | 2003-11-11 | $43,556,000 |