Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12116703 | Method of preparing PAN-based carbon fibers | Na HAN, Chao Wu, Xingxiang Zhang, Jianyong Chen, Zhiheng Sun +2 more | 2024-10-15 |
| 12083718 | Preparation method of high-rate foamed polylactic acid (PLA) sheet | Yanan Song, Weiwei Huang, Zongqiang Zheng, Yining Liu | 2024-09-10 |
| 11844628 | Method of forming a transformer assembly | Mark R. Boone, Mark S. Ricotta, Mohsen Askarinya | 2023-12-19 |
| 11213690 | Wafer level packages of high voltage units for implantable medical devices | Mark R. Boone, Mohsen Askarinya, Randolph E. Crutchfield, Erik J. Herrmann, Mark S. Ricotta | 2022-01-04 |
| 9607759 | Implantable medical device including a molded planar transformer | Mark R. Boone, Mohsen Askarinya, Mark S. Ricotta | 2017-03-28 |
| 9496241 | Integrated circuit packaging for implantable medical devices | Mohsen Askarinya, Mark R. Boone, Andreas Fenner, Kenneth Heames | 2016-11-15 |
| 8824161 | Integrated circuit packaging for implantable medical devices | Mohsen Askarinya, Mark R. Boone, Andreas Fenner, Kenneth Heames | 2014-09-02 |
| 8750961 | Implantable medical device having a multi-axis magnetic sensor | Andrew J. Ries, Mark E. Henschel, Lawrence C. McClure, Mark S. Ricotta | 2014-06-10 |
| 8133583 | Fire retardant antiflux fiber and its production process | Sufeng Tian | 2012-03-13 |
| 7359211 | Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same | Juan Landeros, Jason Zhang | 2008-04-15 |
| 7199342 | Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy | Glenn Ratificar, Carlos Gonzalez | 2007-04-03 |
| 7179684 | Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material | Song Shi, Tian-An Chen | 2007-02-20 |
| 6899960 | Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material | Song Shi, Tian-An Chen | 2005-05-31 |
| 6730542 | Polybenzoxazine based wafer-level underfill material | Song Shi, Tian-An Chen | 2004-05-04 |
| 6727594 | Polybenzoxazine based wafer-level underfill material | Song Shi, Tian-An Chen | 2004-04-27 |
| 6644536 | Solder reflow with microwave energy | Glenn Ratificar, Carlos Gonzalez | 2003-11-11 |
| 6570029 | No-flow reworkable epoxy underfills for flip-chip applications | Haiying Li, Ching-Ping Wong | 2003-05-27 |
| 6498260 | Thermally degradable epoxy underfills for flip-chip applications | Haiying Li, Ching-Ping Wong | 2002-12-24 |
| 6172141 | Reworkable epoxy underfill encapsulants | Ching-Ping Wong | 2001-01-09 |