Lejun Wang — 19 Patents at Intel

Lejun Wang has been granted 19 US patents while listed as an inventor at Intel. The first was granted in 2001 and the most recent in October 2024. Lejun Wang ranks #229,345 of 4,157,543 US inventors in our database (top 5.5%). Patent records list Lejun Wang in San Diego, CA, US.

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12116703	Method of preparing PAN-based carbon fibers	Na HAN, Chao Wu, Xingxiang Zhang, Jianyong Chen, Zhiheng Sun +2 more	2024-10-15
12083718	Preparation method of high-rate foamed polylactic acid (PLA) sheet	Yanan Song, Weiwei Huang, Zongqiang Zheng, Yining Liu	2024-09-10
11844628	Method of forming a transformer assembly	Mark R. Boone, Mark S. Ricotta, Mohsen Askarinya	2023-12-19	$52,128,000
11213690	Wafer level packages of high voltage units for implantable medical devices	Mark R. Boone, Mohsen Askarinya, Randolph E. Crutchfield, Erik J. Herrmann, Mark S. Ricotta	2022-01-04	$41,618,000
9607759	Implantable medical device including a molded planar transformer	Mark R. Boone, Mohsen Askarinya, Mark S. Ricotta	2017-03-28	$40,920,000
9496241	Integrated circuit packaging for implantable medical devices	Mohsen Askarinya, Mark R. Boone, Andreas Fenner, Kenneth Heames	2016-11-15	$33,415,000
8824161	Integrated circuit packaging for implantable medical devices	Mohsen Askarinya, Mark R. Boone, Andreas Fenner, Kenneth Heames	2014-09-02	$18,069,000
8750961	Implantable medical device having a multi-axis magnetic sensor	Andrew J. Ries, Mark E. Henschel, Lawrence C. McClure, Mark S. Ricotta	2014-06-10	$11,463,000
8133583	Fire retardant antiflux fiber and its production process	Sufeng Tian	2012-03-13
7359211	Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same	Juan Landeros, Jason Zhang	2008-04-15	$20,104,000
7199342	Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy	Glenn Ratificar, Carlos Gonzalez	2007-04-03	$17,128,000
7179684	Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material	Song Shi, Tian-An Chen	2007-02-20	$9,940,000
6899960	Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material	Song Shi, Tian-An Chen	2005-05-31	$34,079,000
6730542	Polybenzoxazine based wafer-level underfill material	Song Shi, Tian-An Chen	2004-05-04	$23,705,000
6727594	Polybenzoxazine based wafer-level underfill material	Song Shi, Tian-An Chen	2004-04-27	$48,199,000
6644536	Solder reflow with microwave energy	Glenn Ratificar, Carlos Gonzalez	2003-11-11	$43,556,000
6570029	No-flow reworkable epoxy underfills for flip-chip applications	Haiying Li, Ching-Ping Wong	2003-05-27
6498260	Thermally degradable epoxy underfills for flip-chip applications	Haiying Li, Ching-Ping Wong	2002-12-24
6172141	Reworkable epoxy underfill encapsulants	Ching-Ping Wong	2001-01-09

Lejun Wang — 19 Patents

Issued Patents All Time

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