Issued Patents All Time
Showing 25 most recent of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11845663 | Method for integrally forming graphene film (GF) of high specific surface area (SSA) by ultrafast ultraviolet (UV) laser processing | Huilong LIU, Yun Chen, Xin Chen, Yixin Zheng, Kyoung Sik Moon +2 more | 2023-12-19 |
| 10850304 | Method and device for processing microstructure arrays of polystyrene-graphene nanocomposites | Yun Chen, Junyu Long, Shuang Zhou, Xin Chen, Jian Gao +2 more | 2020-12-01 |
| 10784400 | Mass transfer method for micro-LEDs with a temperature-controlled adhesive layer | Yun Chen, Dachuang Shi, Xin Chen, Qiang Liu, Jian Gao | 2020-09-22 |
| 10134634 | Metal-assisted chemical etching of a semiconductive substrate with high aspect ratio, high geometic uniformity, and controlled 3D profiles | Liyi Li, Jack K. Moon, Xueying Zhao | 2018-11-20 |
| 9490043 | Highly conductive electrically conductive adhesives | Rongwei Zhang | 2016-11-08 |
| 8702897 | Structures including carbon nanotubes, methods of making structures, and methods of using structures | Wei-Chi Lin | 2014-04-22 |
| 8278191 | Methods and systems for metal-assisted chemical etching of substrates | Owen Hildreth, Yonghao Xiu | 2012-10-02 |
| 8206776 | Insulator coating for reducing power line system pollution problems | Jun Li, Lianhua Fan, Franklin Lambert | 2012-06-26 |
| 8173525 | Systems and methods for nanomaterial transfer | Samuel Graham, Jr., William P. King | 2012-05-08 |
| 7722951 | Insulator coating and method for forming same | Jun Li, Lianhua Fan, Franklin Lambert | 2010-05-25 |
| 7663381 | Electrical condition monitoring method for polymers | Kenneth S. Watkins, Jr., Shelby J. Morris, Daniel D. Masakowski, Shijian Luo | 2010-02-16 |
| 7527749 | Electrically conductive adhesives and methods of making | Yi-Zhong Li, Kyoung Sik Moon | 2009-05-05 |
| 7414416 | Electrical condition monitoring method for polymers | Kenneth S. Watkins, Jr., Shelby J. Morris, Daniel D. Masakowski, Shijian Luo | 2008-08-19 |
| 7189795 | Poly(arylene ether)s bearing grafted hydroxyalkyls for use in electrically conductive adhesives | William F. Burgoyne, Jr., Silvia Liong | 2007-03-13 |
| 6989433 | Low stress conformal coatings of reliability without hermeticity for microelectromechanical system based multichip module encapsulation | Jiali Wu | 2006-01-24 |
| 6864306 | High dielectric polymer composites and methods of preparation thereof | Yang Rao, Jianwen Xu | 2005-03-08 |
| 6746896 | Process and material for low-cost flip-chip solder interconnect structures | Song Shi | 2004-06-08 |
| 6740192 | Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane | Daoqiang Lu | 2004-05-25 |
| 6570029 | No-flow reworkable epoxy underfills for flip-chip applications | Lejun Wang, Haiying Li | 2003-05-27 |
| 6544651 | High dielectric constant nano-structure polymer-ceramic composite | Yang Rao | 2003-04-08 |
| 6498260 | Thermally degradable epoxy underfills for flip-chip applications | Lejun Wang, Haiying Li | 2002-12-24 |
| 6380322 | Reworkable high temperature adhesives | Jiali Wu | 2002-04-30 |
| 6180696 | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant | Song Shi | 2001-01-30 |
| 6172141 | Reworkable epoxy underfill encapsulants | Lejun Wang | 2001-01-09 |
| 5863351 | Method for cleaning an object soldered with a lead-containing solder | — | 1999-01-26 |