Issued Patents All Time
Showing 25 most recent of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11597788 | Light curable composition | Heqiang Zhang, Chongjian Song, Zuohe Wang, Benchi Lu | 2023-03-07 |
| 11566151 | Photo-curable liquid optically clear adhesive composition and the use thereof | Hongyu Wang, Xin Wang, Junichi Sawanobori, Chunfu Chen, Victor Lu | 2023-01-31 |
| 10717907 | Photo-curable adhesive composition, preparation and use thereof | Hongyu Wang, Chunfu Chen, Minrui Li, Yinxiao Yuan | 2020-07-21 |
| 10308846 | Ultra-violet-curable and moisture-curable adhesive composition | Rui Zhang, Shabbir Attarwala | 2019-06-04 |
| 10093837 | Process for binding substrates with a liquid optically clear photo-curable adhesive | Masao Kanari, Junichi Sawanobori | 2018-10-09 |
| 9783710 | Triply curable optically clear adhesive | Raymond Zhang, Shabbir Attarwala | 2017-10-10 |
| 9783713 | Dual-curable adhesive composition, use thereof, and process for bonding substrates | Rui Zhang | 2017-10-10 |
| 9708518 | Optical transparent dual cure adhesives composition | Rui Zhang | 2017-07-18 |
| 9663685 | Photocurable adhesive composition and use of the same | James P. Wang | 2017-05-30 |
| 9511453 | Solder paste composition, a solder paste and a soldering flux | Huiying YANG | 2016-12-06 |
| 9508675 | Microelectronic package having direct contact heat spreader and method of manufacturing same | Chuan Hu, Gilroy Vandentop, Shriram Ramanathan, Rajashree Baskaran, Valery M. Dubin | 2016-11-29 |
| 9039852 | Method for bonding substrates using a UV radiation curing-redox curing adhesive system | Shabbir Attarwala, Nicolas Zhou, Yinxiao Yuan, Chongjian Song | 2015-05-26 |
| 8642386 | Heat spreader as mechanical reinforcement for ultra-thin die | — | 2014-02-04 |
| 8541876 | Microelectronic package having direct contact heat spreader and method of manufacturing same | Chuan Hu, Gilroy Vandentop, Shriram Ramanathan, Rajashree Baskaran, Valery M. Dubin | 2013-09-24 |
| 8230589 | Method of mounting an optical device | Johanna M. Swan, Henning Braunisch | 2012-07-31 |
| 8193072 | Semiconductor wafer coat layers and methods therefor | Eric J. Li, Christopher L. Rumer, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more | 2012-06-05 |
| 8189361 | Multi-chip assembly with optically coupled die | Qing Zhou, Jiangqi He, Wei Shi, Xiang Yin Zeng | 2012-05-29 |
| 8148805 | Forming compliant contact pads for semiconductor packages | Qing Zhou, Wei Shi, Jiangqi He | 2012-04-03 |
| 8063482 | Heat spreader as mechanical reinforcement for ultra-thin die | — | 2011-11-22 |
| 8012808 | Integrated micro-channels for 3D through silicon architectures | Wei Shi, Yiqun Bai, Qing Zhou, Jianqqi He | 2011-09-06 |
| 7980865 | Substrate with raised edge pads | Wei Shi, Qing Zhou, Jiangqi He | 2011-07-19 |
| 7945127 | Electrically pluggable optical interconnect | — | 2011-05-17 |
| 7939922 | Forming compliant contact pads for semiconductor packages | Qing Zhou, Wei Shi, Jiangqi He | 2011-05-10 |
| 7897486 | Semiconductor wafer coat layers and methods therefor | Eric J. Li, Christopher L. Rumer, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more | 2011-03-01 |
| 7851809 | Multi-chip assembly with optically coupled die | Qing Zhou, Jiangqi He, Wei Shi, Xiang Yin Zeng | 2010-12-14 |