| 11597788 |
Light curable composition |
Heqiang Zhang, Chongjian Song, Zuohe Wang, Benchi Lu |
2023-03-07 |
|
| 11566151 |
Photo-curable liquid optically clear adhesive composition and the use thereof |
Hongyu Wang, Xin Wang, Junichi Sawanobori, Chunfu Chen, Victor Lu |
2023-01-31 |
|
| 10717907 |
Photo-curable adhesive composition, preparation and use thereof |
Hongyu Wang, Chunfu Chen, Minrui Li, Yinxiao Yuan |
2020-07-21 |
|
| 10308846 |
Ultra-violet-curable and moisture-curable adhesive composition |
Rui Zhang, Shabbir Attarwala |
2019-06-04 |
|
| 10093837 |
Process for binding substrates with a liquid optically clear photo-curable adhesive |
Masao Kanari, Junichi Sawanobori |
2018-10-09 |
|
| 9783710 |
Triply curable optically clear adhesive |
Raymond Zhang, Shabbir Attarwala |
2017-10-10 |
|
| 9783713 |
Dual-curable adhesive composition, use thereof, and process for bonding substrates |
Rui Zhang |
2017-10-10 |
|
| 9708518 |
Optical transparent dual cure adhesives composition |
Rui Zhang |
2017-07-18 |
|
| 9663685 |
Photocurable adhesive composition and use of the same |
James P. Wang |
2017-05-30 |
|
| 9511453 |
Solder paste composition, a solder paste and a soldering flux |
Huiying YANG |
2016-12-06 |
|
| 9508675 |
Microelectronic package having direct contact heat spreader and method of manufacturing same |
Chuan Hu, Gilroy Vandentop, Shriram Ramanathan, Rajashree Baskaran, Valery M. Dubin |
2016-11-29 |
$9,403,000 |
| 9039852 |
Method for bonding substrates using a UV radiation curing-redox curing adhesive system |
Shabbir Attarwala, Nicolas Zhou, Yinxiao Yuan, Chongjian Song |
2015-05-26 |
|
| 8642386 |
Heat spreader as mechanical reinforcement for ultra-thin die |
— |
2014-02-04 |
$11,338,000 |
| 8541876 |
Microelectronic package having direct contact heat spreader and method of manufacturing same |
Chuan Hu, Gilroy Vandentop, Shriram Ramanathan, Rajashree Baskaran, Valery M. Dubin |
2013-09-24 |
$22,458,000 |
| 8230589 |
Method of mounting an optical device |
Johanna M. Swan, Henning Braunisch |
2012-07-31 |
$31,198,000 |
| 8193072 |
Semiconductor wafer coat layers and methods therefor |
Eric J. Li, Christopher L. Rumer, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more |
2012-06-05 |
$18,221,000 |
| 8189361 |
Multi-chip assembly with optically coupled die |
Qing Zhou, Jiangqi He, Wei Shi, Xiang Yin Zeng |
2012-05-29 |
$17,150,000 |
| 8148805 |
Forming compliant contact pads for semiconductor packages |
Qing Zhou, Wei Shi, Jiangqi He |
2012-04-03 |
$17,954,000 |
| 8063482 |
Heat spreader as mechanical reinforcement for ultra-thin die |
— |
2011-11-22 |
$16,463,000 |
| 8012808 |
Integrated micro-channels for 3D through silicon architectures |
Wei Shi, Yiqun Bai, Qing Zhou, Jianqqi He |
2011-09-06 |
$20,814,000 |
| 7980865 |
Substrate with raised edge pads |
Wei Shi, Qing Zhou, Jiangqi He |
2011-07-19 |
$15,862,000 |
| 7945127 |
Electrically pluggable optical interconnect |
— |
2011-05-17 |
$24,931,000 |
| 7939922 |
Forming compliant contact pads for semiconductor packages |
Qing Zhou, Wei Shi, Jiangqi He |
2011-05-10 |
$28,280,000 |
| 7897486 |
Semiconductor wafer coat layers and methods therefor |
Eric J. Li, Christopher L. Rumer, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more |
2011-03-01 |
$14,929,000 |
| 7851809 |
Multi-chip assembly with optically coupled die |
Qing Zhou, Jiangqi He, Wei Shi, Xiang Yin Zeng |
2010-12-14 |
$13,117,000 |
