Qing Zhou has been granted 12 US patents while listed as an inventor at Intel . The first was granted in 2008 and the most recent in December 2023. Qing Zhou ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list Qing Zhou in Chandler, AZ, US.
Patents per Year Patents granted per year, 2008 to 2023 Bar chart with a peak of 3 patents in 2009. peak 3 2008: 2 patents 2008 2009: 3 patents 2009 2010: 1 patents 2010 2011: 3 patents 2011 2012: 2 patents 2012 2023: 1 patents 2023
Issued Patents All Time
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Showing 1–12 of 12 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
11851966 Horizontal sampling soil drilling rig and control method thereof Maoyong He , Li Deng , Zhangdong Jin , Jun Xiao , Yuanyuan Cheng +1 more 2023-12-26
8189361 Multi-chip assembly with optically coupled die Daoqiang Lu , Jiangqi He , Wei Shi , Xiang Yin Zeng 2012-05-29
$17,150,000
8148805 Forming compliant contact pads for semiconductor packages Wei Shi , Daoqiang Lu , Jiangqi He 2012-04-03
$17,954,000
8012808 Integrated micro-channels for 3D through silicon architectures Wei Shi , Daoqiang Lu , Yiqun Bai , Jianqqi He 2011-09-06
$20,814,000
7980865 Substrate with raised edge pads Wei Shi , Daoqiang Lu , Jiangqi He 2011-07-19
$15,862,000
7939922 Forming compliant contact pads for semiconductor packages Wei Shi , Daoqiang Lu , Jiangqi He 2011-05-10
$28,280,000
7851809 Multi-chip assembly with optically coupled die Daoqiang Lu , Jiangqi He , Wei Shi , Xiang Yin Zeng 2010-12-14
$13,117,000
7564066 Multi-chip assembly with optically coupled die Daoqiang Lu , Jiangqi He , Wei Shi , Xiang Yin Zeng 2009-07-21
$22,981,000
7554203 Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture Daoqiang Lu , Wei Shi , Jiangqi He 2009-06-30
$20,585,000
7538019 Forming compliant contact pads for semiconductor packages Wei Shi , Daoqiang Lu , Jiangqi He 2009-05-26
$14,272,000
7432592 Integrated micro-channels for 3D through silicon architectures Wei Shi , Daoqiang Lu , Yiqun Bai , Jiangqi He 2008-10-07
$21,141,000
7348678 Integrated circuit package to provide high-bandwidth communication among multiple dice Wei Shi , Jiangqi He , Daoqiang Lu 2008-03-25
$11,219,000
