| 11851966 |
Horizontal sampling soil drilling rig and control method thereof |
Maoyong He, Li Deng, Zhangdong Jin, Jun Xiao, Yuanyuan Cheng +1 more |
2023-12-26 |
| 8189361 |
Multi-chip assembly with optically coupled die |
Daoqiang Lu, Jiangqi He, Wei Shi, Xiang Yin Zeng |
2012-05-29 |
| 8148805 |
Forming compliant contact pads for semiconductor packages |
Wei Shi, Daoqiang Lu, Jiangqi He |
2012-04-03 |
| 8012808 |
Integrated micro-channels for 3D through silicon architectures |
Wei Shi, Daoqiang Lu, Yiqun Bai, Jianqqi He |
2011-09-06 |
| 7980865 |
Substrate with raised edge pads |
Wei Shi, Daoqiang Lu, Jiangqi He |
2011-07-19 |
| 7939922 |
Forming compliant contact pads for semiconductor packages |
Wei Shi, Daoqiang Lu, Jiangqi He |
2011-05-10 |
| 7851809 |
Multi-chip assembly with optically coupled die |
Daoqiang Lu, Jiangqi He, Wei Shi, Xiang Yin Zeng |
2010-12-14 |
| 7564066 |
Multi-chip assembly with optically coupled die |
Daoqiang Lu, Jiangqi He, Wei Shi, Xiang Yin Zeng |
2009-07-21 |
| 7554203 |
Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture |
Daoqiang Lu, Wei Shi, Jiangqi He |
2009-06-30 |
| 7538019 |
Forming compliant contact pads for semiconductor packages |
Wei Shi, Daoqiang Lu, Jiangqi He |
2009-05-26 |
| 7432592 |
Integrated micro-channels for 3D through silicon architectures |
Wei Shi, Daoqiang Lu, Yiqun Bai, Jiangqi He |
2008-10-07 |
| 7348678 |
Integrated circuit package to provide high-bandwidth communication among multiple dice |
Wei Shi, Jiangqi He, Daoqiang Lu |
2008-03-25 |