Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11851966 | Horizontal sampling soil drilling rig and control method thereof | Maoyong He, Li Deng, Zhangdong Jin, Jun Xiao, Yuanyuan Cheng +1 more | 2023-12-26 |
| 8189361 | Multi-chip assembly with optically coupled die | Daoqiang Lu, Jiangqi He, Wei Shi, Xiang Yin Zeng | 2012-05-29 |
| 8148805 | Forming compliant contact pads for semiconductor packages | Wei Shi, Daoqiang Lu, Jiangqi He | 2012-04-03 |
| 8012808 | Integrated micro-channels for 3D through silicon architectures | Wei Shi, Daoqiang Lu, Yiqun Bai, Jianqqi He | 2011-09-06 |
| 7980865 | Substrate with raised edge pads | Wei Shi, Daoqiang Lu, Jiangqi He | 2011-07-19 |
| 7939922 | Forming compliant contact pads for semiconductor packages | Wei Shi, Daoqiang Lu, Jiangqi He | 2011-05-10 |
| 7851809 | Multi-chip assembly with optically coupled die | Daoqiang Lu, Jiangqi He, Wei Shi, Xiang Yin Zeng | 2010-12-14 |
| 7564066 | Multi-chip assembly with optically coupled die | Daoqiang Lu, Jiangqi He, Wei Shi, Xiang Yin Zeng | 2009-07-21 |
| 7554203 | Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture | Daoqiang Lu, Wei Shi, Jiangqi He | 2009-06-30 |
| 7538019 | Forming compliant contact pads for semiconductor packages | Wei Shi, Daoqiang Lu, Jiangqi He | 2009-05-26 |
| 7432592 | Integrated micro-channels for 3D through silicon architectures | Wei Shi, Daoqiang Lu, Yiqun Bai, Jiangqi He | 2008-10-07 |
| 7348678 | Integrated circuit package to provide high-bandwidth communication among multiple dice | Wei Shi, Jiangqi He, Daoqiang Lu | 2008-03-25 |