Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-chip assembly with optically coupled die

Multi-chip assembly with optically coupled die

US Patent 7564066 · Granted Jul 21, 2009

Estimated economic value: $22,981,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chip-process-variation-aware power-efficiency optimization2024
Horizontal sampling soil drilling rig and control method thereof2023
Light curable composition2023
Photo-curable liquid optically clear adhesive composition and the use thereof2023
Embedded thin-film magnetic inductor design for integrated voltage regulator (IV2022
Photo-curable adhesive composition, preparation and use thereof2020
Technologies for temperature measurement of a processor2019
Ultra-violet-curable and moisture-curable adhesive composition2019
Process for binding substrates with a liquid optically clear photo-curable adhes2018
Stacked wafer lens and camera2018
Triply curable optically clear adhesive2017
Dual-curable adhesive composition, use thereof, and process for bonding substrat2017