Issued Patents All Time
Showing 25 most recent of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12079064 | Chip-process-variation-aware power-efficiency optimization | Zipeng Luo, Tae Hong Kim, Tianming Zhang | 2024-09-03 |
| 11373966 | Embedded thin-film magnetic inductor design for integrated voltage regulator (IVR) applications | Tae Hong Kim, Guotao Wang | 2022-06-28 |
| 10318396 | Technologies for temperature measurement of a processor | Hongfei Yan, Chunlei Guo, Wei Shen | 2019-06-11 |
| 9318850 | Shielding a connector to reduce interference | Xiang Li, Hao-Han Hsu, Yun Ling, Gong Ouyang, Kai Xiao +2 more | 2016-04-19 |
| 8465297 | Self referencing pin | Bin Zou, Yan Guo, Robert L. Sankman | 2013-06-18 |
| 8189361 | Multi-chip assembly with optically coupled die | Qing Zhou, Daoqiang Lu, Wei Shi, Xiang Yin Zeng | 2012-05-29 |
| 8148805 | Forming compliant contact pads for semiconductor packages | Qing Zhou, Wei Shi, Daoqiang Lu | 2012-04-03 |
| 7989916 | Integrated capacitors in package-level structures, processes of making same, and systems containing same | John Tang, Xiang Yin Zeng, Ding Hai | 2011-08-02 |
| 7980865 | Substrate with raised edge pads | Wei Shi, Daoqiang Lu, Qing Zhou | 2011-07-19 |
| 7939922 | Forming compliant contact pads for semiconductor packages | Qing Zhou, Wei Shi, Daoqiang Lu | 2011-05-10 |
| 7851809 | Multi-chip assembly with optically coupled die | Qing Zhou, Daoqiang Lu, Wei Shi, Xiang Yin Zeng | 2010-12-14 |
| 7852189 | Packaged spiral inductor structures, processes of making same, and systems containing same | Robert L. Sankman, BaoShu Xu, Xiang Yin Zeng | 2010-12-14 |
| 7723164 | Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same | Daoqiang Lu, Xiang Yin Zeng, Jiamiao Tang | 2010-05-25 |
| 7714430 | Substrate with lossy material insert | Xiang Yin Zeng, Daoqiang Lu, Jiamiao(John) Tang | 2010-05-11 |
| 7709934 | Package level noise isolation | Xiang Yin Zeng, Guizhen Zheng | 2010-05-04 |
| 7670919 | Integrated capacitors in package-level structures, processes of making same, and systems containing same | John Tang, Xiang Yin Zeng, Ding Hai | 2010-03-02 |
| 7659143 | Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same | Jiamiao Tang, Daoqiang Lu, Xiang Yin Zeng | 2010-02-09 |
| 7611924 | Integrated circuit package with chip-side signal connections | Joong-Ho Kim, Dong-Ho Han, Hyunjun Kim | 2009-11-03 |
| 7589414 | I/O Architecture for integrated circuit package | Yuan-Liang Li, Michael Walk | 2009-09-15 |
| 7564066 | Multi-chip assembly with optically coupled die | Qing Zhou, Daoqiang Lu, Wei Shi, Xiang Yin Zeng | 2009-07-21 |
| 7554203 | Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture | Qing Zhou, Daoqiang Lu, Wei Shi | 2009-06-30 |
| 7538019 | Forming compliant contact pads for semiconductor packages | Qing Zhou, Wei Shi, Daoqiang Lu | 2009-05-26 |
| 7535689 | Reducing input capacitance of high speed integrated circuits | Xiang Yin Zeng, Ming Dong Cui, Gregory V. Christensen, Mostafa Naguib Abdulla, Daoqiang Lu +1 more | 2009-05-19 |
| 7535080 | Reducing parasitic mutual capacitances | Xiang Yin Zeng, BaoShu Xu | 2009-05-19 |
| 7511359 | Dual die package with high-speed interconnect | John Tang, Xiang Yin Zeng | 2009-03-31 |