| 12079064 |
Chip-process-variation-aware power-efficiency optimization |
Zipeng Luo, Tae Hong Kim, Tianming Zhang |
2024-09-03 |
|
| 11373966 |
Embedded thin-film magnetic inductor design for integrated voltage regulator (IVR) applications |
Tae Hong Kim, Guotao Wang |
2022-06-28 |
|
| 10318396 |
Technologies for temperature measurement of a processor |
Hongfei Yan, Chunlei Guo, Wei Shen |
2019-06-11 |
$16,707,000 |
| 9318850 |
Shielding a connector to reduce interference |
Xiang Li, Hao-Han Hsu, Yun Ling, Gong Ouyang, Kai Xiao +2 more |
2016-04-19 |
$11,756,000 |
| 8465297 |
Self referencing pin |
Bin Zou, Yan Guo, Robert L. Sankman |
2013-06-18 |
$21,688,000 |
| 8189361 |
Multi-chip assembly with optically coupled die |
Qing Zhou, Daoqiang Lu, Wei Shi, Xiang Yin Zeng |
2012-05-29 |
$17,150,000 |
| 8148805 |
Forming compliant contact pads for semiconductor packages |
Qing Zhou, Wei Shi, Daoqiang Lu |
2012-04-03 |
$17,954,000 |
| 7989916 |
Integrated capacitors in package-level structures, processes of making same, and systems containing same |
John Tang, Xiang Yin Zeng, Ding Hai |
2011-08-02 |
$15,238,000 |
| 7980865 |
Substrate with raised edge pads |
Wei Shi, Daoqiang Lu, Qing Zhou |
2011-07-19 |
$15,862,000 |
| 7939922 |
Forming compliant contact pads for semiconductor packages |
Qing Zhou, Wei Shi, Daoqiang Lu |
2011-05-10 |
$28,280,000 |
| 7851809 |
Multi-chip assembly with optically coupled die |
Qing Zhou, Daoqiang Lu, Wei Shi, Xiang Yin Zeng |
2010-12-14 |
$13,117,000 |
| 7852189 |
Packaged spiral inductor structures, processes of making same, and systems containing same |
Robert L. Sankman, BaoShu Xu, Xiang Yin Zeng |
2010-12-14 |
$13,117,000 |
| 7723164 |
Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same |
Daoqiang Lu, Xiang Yin Zeng, Jiamiao Tang |
2010-05-25 |
$11,401,000 |
| 7714430 |
Substrate with lossy material insert |
Xiang Yin Zeng, Daoqiang Lu, Jiamiao(John) Tang |
2010-05-11 |
$17,259,000 |
| 7709934 |
Package level noise isolation |
Xiang Yin Zeng, Guizhen Zheng |
2010-05-04 |
$15,201,000 |
| 7670919 |
Integrated capacitors in package-level structures, processes of making same, and systems containing same |
John Tang, Xiang Yin Zeng, Ding Hai |
2010-03-02 |
$14,883,000 |
| 7659143 |
Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same |
Jiamiao Tang, Daoqiang Lu, Xiang Yin Zeng |
2010-02-09 |
$29,195,000 |
| 7611924 |
Integrated circuit package with chip-side signal connections |
Joong-Ho Kim, Dong-Ho Han, Hyunjun Kim |
2009-11-03 |
$21,230,000 |
| 7589414 |
I/O Architecture for integrated circuit package |
Yuan-Liang Li, Michael Walk |
2009-09-15 |
$19,566,000 |
| 7564066 |
Multi-chip assembly with optically coupled die |
Qing Zhou, Daoqiang Lu, Wei Shi, Xiang Yin Zeng |
2009-07-21 |
$22,981,000 |
| 7554203 |
Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture |
Qing Zhou, Daoqiang Lu, Wei Shi |
2009-06-30 |
$20,585,000 |
| 7538019 |
Forming compliant contact pads for semiconductor packages |
Qing Zhou, Wei Shi, Daoqiang Lu |
2009-05-26 |
$14,272,000 |
| 7535689 |
Reducing input capacitance of high speed integrated circuits |
Xiang Yin Zeng, Ming Dong Cui, Gregory V. Christensen, Mostafa Naguib Abdulla, Daoqiang Lu +1 more |
2009-05-19 |
$16,372,000 |
| 7535080 |
Reducing parasitic mutual capacitances |
Xiang Yin Zeng, BaoShu Xu |
2009-05-19 |
$16,372,000 |
| 7511359 |
Dual die package with high-speed interconnect |
John Tang, Xiang Yin Zeng |
2009-03-31 |
$17,039,000 |
