Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347590 | Leadframe for a semiconductor component | Olivier Pola | 2019-07-09 |
| 7637008 | Methods for manufacturing imprinted substrates | Thomas Dory, Robert L. Sankman, Boyd Coomer | 2009-12-29 |
| 7594321 | Substrate-imprinting methods | Thomas Dory | 2009-09-29 |
| 7589414 | I/O Architecture for integrated circuit package | Jiangqi He, Yuan-Liang Li | 2009-09-15 |
| 7371975 | Electronic packages and components thereof formed by substrate-imprinting | Thomas Dory | 2008-05-13 |
| 7335979 | Device and method for tilted land grid array interconnects on a coreless substrate package | — | 2008-02-26 |
| 7329946 | I/O architecture for integrated circuit package | Jianqi He, Yuan-Liang Li | 2008-02-12 |
| 7245001 | Multi-layer integrated circuit package | Boyd Coomer | 2007-07-17 |
| 7220132 | Tilted land grid array package and socket, systems, and methods | Brent Stone | 2007-05-22 |
| 7186365 | Methods for forming an imprinting tool | — | 2007-03-06 |
| 7042077 | Integrated circuit package with low modulus layer and capacitor/interposer | Hamid Azimi, John S. Guzek, Charan Gurumurthy | 2006-05-09 |
| 6899815 | Multi-layer integrated circuit package | Boyd Coomer | 2005-05-31 |
| 6897556 | I/O architecture for integrated circuit package | Jianqi He, Yuan-Liang Li | 2005-05-24 |
| 6483692 | Capacitor with extended surface lands and method of fabrication therefor | David G. Figueroa, Huong Do, Jorge P. Rodriguez | 2002-11-19 |
| 6477034 | Interposer substrate with low inductance capacitive paths | Kishore K. Chakravorty | 2002-11-05 |
| 6407929 | Electronic package having embedded capacitors and method of fabrication therefor | Aaron Dean Hale, David G. Figueroa, Joan K. Vrtis, Toshimi Kohmura | 2002-06-18 |
| 6388207 | Electronic assembly with trench structures and methods of manufacture | David G. Figueroa, Yuan-Liang Li, Robert L. Sankman | 2002-05-14 |