Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Michael Walk — 17 Patents

Intel: 16 patents #2,596 of 30,777Top 9%
CGConti Temic Microelectronic Gmbh: 1 patents #235 of 606Top 40%
Overall (All Time): #263,971 of 4,157,543Top 7%
17 Patents All Time
Michael Walk has been granted 17 US patents while listed as an inventor at Intel. The first was granted in 2002 and the most recent in July 2019. Michael Walk ranks #263,971 of 4,157,543 US inventors in our database (top 6.3%). Patent records list Michael Walk in Pilsach, AZ, DE.

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
10347590 Leadframe for a semiconductor component Olivier Pola 2019-07-09
7637008 Methods for manufacturing imprinted substrates Thomas Dory, Robert L. Sankman, Boyd Coomer 2009-12-29 $18,144,000
7594321 Substrate-imprinting methods Thomas Dory 2009-09-29 $24,442,000
7589414 I/O Architecture for integrated circuit package Jiangqi He, Yuan-Liang Li 2009-09-15 $19,566,000
7371975 Electronic packages and components thereof formed by substrate-imprinting Thomas Dory 2008-05-13 $17,373,000
7335979 Device and method for tilted land grid array interconnects on a coreless substrate package 2008-02-26 $16,748,000
7329946 I/O architecture for integrated circuit package Jianqi He, Yuan-Liang Li 2008-02-12 $36,180,000
7245001 Multi-layer integrated circuit package Boyd Coomer 2007-07-17 $13,694,000
7220132 Tilted land grid array package and socket, systems, and methods Brent Stone 2007-05-22 $18,006,000
7186365 Methods for forming an imprinting tool 2007-03-06 $17,685,000
7042077 Integrated circuit package with low modulus layer and capacitor/interposer Hamid Azimi, John S. Guzek, Charan Gurumurthy 2006-05-09 $14,660,000
6899815 Multi-layer integrated circuit package Boyd Coomer 2005-05-31 $34,079,000
6897556 I/O architecture for integrated circuit package Jianqi He, Yuan-Liang Li 2005-05-24 $30,688,000
6483692 Capacitor with extended surface lands and method of fabrication therefor David G. Figueroa, Huong Do, Jorge P. Rodriguez 2002-11-19 $76,016,000
6477034 Interposer substrate with low inductance capacitive paths Kishore K. Chakravorty 2002-11-05 $89,631,000
6407929 Electronic package having embedded capacitors and method of fabrication therefor Aaron Dean Hale, David G. Figueroa, Joan K. Vrtis, Toshimi Kohmura 2002-06-18 $57,699,000
6388207 Electronic assembly with trench structures and methods of manufacture David G. Figueroa, Yuan-Liang Li, Robert L. Sankman 2002-05-14 $103,624,000