| 10347590 |
Leadframe for a semiconductor component |
Olivier Pola |
2019-07-09 |
| 7637008 |
Methods for manufacturing imprinted substrates |
Thomas Dory, Robert L. Sankman, Boyd Coomer |
2009-12-29 |
| 7594321 |
Substrate-imprinting methods |
Thomas Dory |
2009-09-29 |
| 7589414 |
I/O Architecture for integrated circuit package |
Jiangqi He, Yuan-Liang Li |
2009-09-15 |
| 7371975 |
Electronic packages and components thereof formed by substrate-imprinting |
Thomas Dory |
2008-05-13 |
| 7335979 |
Device and method for tilted land grid array interconnects on a coreless substrate package |
— |
2008-02-26 |
| 7329946 |
I/O architecture for integrated circuit package |
Jianqi He, Yuan-Liang Li |
2008-02-12 |
| 7245001 |
Multi-layer integrated circuit package |
Boyd Coomer |
2007-07-17 |
| 7220132 |
Tilted land grid array package and socket, systems, and methods |
Brent Stone |
2007-05-22 |
| 7186365 |
Methods for forming an imprinting tool |
— |
2007-03-06 |
| 7042077 |
Integrated circuit package with low modulus layer and capacitor/interposer |
Hamid Azimi, John S. Guzek, Charan Gurumurthy |
2006-05-09 |
| 6899815 |
Multi-layer integrated circuit package |
Boyd Coomer |
2005-05-31 |
| 6897556 |
I/O architecture for integrated circuit package |
Jianqi He, Yuan-Liang Li |
2005-05-24 |
| 6483692 |
Capacitor with extended surface lands and method of fabrication therefor |
David G. Figueroa, Huong Do, Jorge P. Rodriguez |
2002-11-19 |
| 6477034 |
Interposer substrate with low inductance capacitive paths |
Kishore K. Chakravorty |
2002-11-05 |
| 6407929 |
Electronic package having embedded capacitors and method of fabrication therefor |
Aaron Dean Hale, David G. Figueroa, Joan K. Vrtis, Toshimi Kohmura |
2002-06-18 |
| 6388207 |
Electronic assembly with trench structures and methods of manufacture |
David G. Figueroa, Yuan-Liang Li, Robert L. Sankman |
2002-05-14 |