| 10306760 |
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
Yonggang Li, Islam A. Salama, Hamid Azimi |
2019-05-28 |
$17,387,000 |
| 9966351 |
Grid array connection device and method |
Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Tamil Selvy Selvamuniandy |
2018-05-08 |
$30,284,000 |
| 9941158 |
Integrated circuit and process for fabricating thereof |
Islam A. Salama, Houssam Jomaa, Ravi Tanikella |
2018-04-10 |
$20,820,000 |
| 9698114 |
Grid array connection device and method |
Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Selvy Tamil Selvamuniandy |
2017-07-04 |
|
| 9648733 |
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
Yonggang Li, Islam A. Salama, Hamid Azimi |
2017-05-09 |
$10,144,000 |
| 9554472 |
Panel with releasable core |
Ching-Ping Janet Shen, Ravi Shankar, Yonggang Li, Dilan Seneviratne |
2017-01-24 |
$12,666,000 |
| 9554468 |
Panel with releasable core |
Ching-Ping Janet Shen, Dilan Seneviratne, Ravi Shankar, Liwen Jin, Deepak Arora |
2017-01-24 |
$12,666,000 |
| 9449936 |
Grid array connection device and method |
Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Tamil Selvy Selvamuniandy |
2016-09-20 |
$10,814,000 |
| 9049807 |
Processes of making pad-less interconnect for electrical coreless substrate |
Javier Soto, Robert M. Nickerson, Debendra Mallik |
2015-06-02 |
$17,367,000 |
| 8877565 |
Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method |
Yonggang Li, Islam A. Salama |
2014-11-04 |
$23,728,000 |
| 8456016 |
Method and core materials for semiconductor packaging |
Yonggang Li, Amruthavalli Pallavi Alur, Devarajan Balaraman, Xiwang Qi |
2013-06-04 |
$16,514,000 |
| 8440916 |
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
Yonggang Li, Islam A. Salama, Hamid Azimi |
2013-05-14 |
$17,697,000 |
| 8395051 |
Doping of lead-free solder alloys and structures formed thereby |
Mengzhi Pang |
2013-03-12 |
$18,179,000 |
| 8353101 |
Method of making substrate package with through holes for high speed I/O flex cable |
Sanka Ganesan, Chandrashekar Ramaswamy, Mark S. Hlad |
2013-01-15 |
$22,820,000 |
| 8115307 |
Embedding device in substrate cavity |
Munehiro Toyama, Toshimi Kohmura |
2012-02-14 |
$32,719,000 |
| 7998857 |
Integrated circuit and process for fabricating thereof |
Islam A. Salama, Houssam Jomaa, Ravi Tanikella |
2011-08-16 |
$18,060,000 |
| 7985622 |
Method of forming collapse chip connection bumps on a semiconductor substrate |
Ravi Kiran Nalla, Islam A. Salama, Hamid Azimi |
2011-07-26 |
$21,887,000 |
| 7956713 |
Forming a helical inductor |
Arun Chandrasekhar, Srikrishnan Venkataraman, Priyavadan R. Patel, Shamala Chickamenahalli, Robert J. Fite |
2011-06-07 |
$16,749,000 |
| 7915060 |
Grid array connection device and method |
Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Selvy Tamil Selvamuniandy |
2011-03-29 |
$16,404,000 |
| 7888784 |
Substrate package with through holes for high speed I/O flex cable |
Sanka Ganesan, Chandrashekhar Ramaswamy, Mark S. Hlad |
2011-02-15 |
$18,725,000 |
| 7831115 |
Optical die structures and associated package substrates |
Omar J. Bchir, Islam A. Salama, Houssam Jomaa, Ravi Kiran Nalla |
2010-11-09 |
$16,505,000 |
| 7790598 |
System, apparatus, and method for advanced solder bumping |
Mengzhi Pang, Christopher Bahr, Ravindra Tanikella |
2010-09-07 |
$9,640,000 |
| 7749900 |
Method and core materials for semiconductor packaging |
Yonggang Li, Amruthavalli Pallavi Alur, Devarajan Balaraman, Xiwang Qi |
2010-07-06 |
$9,424,000 |
| 7670951 |
Grid array connection device and method |
Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Selvy Tamil Selvamuniandy |
2010-03-02 |
$14,883,000 |
| 7666714 |
Assembly of thin die coreless package |
Daoqiang Lu, Rajashree Baskaran |
2010-02-23 |
$16,403,000 |
