Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10306760 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Yonggang Li, Islam A. Salama, Hamid Azimi | 2019-05-28 |
| 9966351 | Grid array connection device and method | Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Tamil Selvy Selvamuniandy | 2018-05-08 |
| 9941158 | Integrated circuit and process for fabricating thereof | Islam A. Salama, Houssam Jomaa, Ravi Tanikella | 2018-04-10 |
| 9698114 | Grid array connection device and method | Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Selvy Tamil Selvamuniandy | 2017-07-04 |
| 9648733 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Yonggang Li, Islam A. Salama, Hamid Azimi | 2017-05-09 |
| 9554472 | Panel with releasable core | Ching-Ping Janet Shen, Ravi Shankar, Yonggang Li, Dilan Seneviratne | 2017-01-24 |
| 9554468 | Panel with releasable core | Ching-Ping Janet Shen, Dilan Seneviratne, Ravi Shankar, Liwen Jin, Deepak Arora | 2017-01-24 |
| 9449936 | Grid array connection device and method | Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Tamil Selvy Selvamuniandy | 2016-09-20 |
| 9049807 | Processes of making pad-less interconnect for electrical coreless substrate | Javier Soto, Robert M. Nickerson, Debendra Mallik | 2015-06-02 |
| 8877565 | Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method | Yonggang Li, Islam A. Salama | 2014-11-04 |
| 8456016 | Method and core materials for semiconductor packaging | Yonggang Li, Amruthavalli Pallavi Alur, Devarajan Balaraman, Xiwang Qi | 2013-06-04 |
| 8440916 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Yonggang Li, Islam A. Salama, Hamid Azimi | 2013-05-14 |
| 8395051 | Doping of lead-free solder alloys and structures formed thereby | Mengzhi Pang | 2013-03-12 |
| 8353101 | Method of making substrate package with through holes for high speed I/O flex cable | Sanka Ganesan, Chandrashekar Ramaswamy, Mark S. Hlad | 2013-01-15 |
| 8115307 | Embedding device in substrate cavity | Munehiro Toyama, Toshimi Kohmura | 2012-02-14 |
| 7998857 | Integrated circuit and process for fabricating thereof | Islam A. Salama, Houssam Jomaa, Ravi Tanikella | 2011-08-16 |
| 7985622 | Method of forming collapse chip connection bumps on a semiconductor substrate | Ravi Kiran Nalla, Islam A. Salama, Hamid Azimi | 2011-07-26 |
| 7956713 | Forming a helical inductor | Arun Chandrasekhar, Srikrishnan Venkataraman, Priyavadan R. Patel, Shamala Chickamenahalli, Robert J. Fite | 2011-06-07 |
| 7915060 | Grid array connection device and method | Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Selvy Tamil Selvamuniandy | 2011-03-29 |
| 7888784 | Substrate package with through holes for high speed I/O flex cable | Sanka Ganesan, Chandrashekhar Ramaswamy, Mark S. Hlad | 2011-02-15 |
| 7831115 | Optical die structures and associated package substrates | Omar J. Bchir, Islam A. Salama, Houssam Jomaa, Ravi Kiran Nalla | 2010-11-09 |
| 7790598 | System, apparatus, and method for advanced solder bumping | Mengzhi Pang, Christopher Bahr, Ravindra Tanikella | 2010-09-07 |
| 7749900 | Method and core materials for semiconductor packaging | Yonggang Li, Amruthavalli Pallavi Alur, Devarajan Balaraman, Xiwang Qi | 2010-07-06 |
| 7670951 | Grid array connection device and method | Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Selvy Tamil Selvamuniandy | 2010-03-02 |
| 7666714 | Assembly of thin die coreless package | Daoqiang Lu, Rajashree Baskaran | 2010-02-23 |