Issued Patents All Time
Showing 25 most recent of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046560 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more | 2024-07-23 |
| 12040276 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Jonathan L. Rosch, Kristof Darmawikarta | 2024-07-16 |
| 12014989 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Jonathan L. Rosch, Kristof Darmawikarta | 2024-06-18 |
| 11894311 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more | 2024-02-06 |
| 11764158 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Robert L. Sankman | 2023-09-19 |
| 11581271 | Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate | Rahul Jain, Kyu Oh Lee, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen, Yongki Min +1 more | 2023-02-14 |
| 11552019 | Substrate patch reconstitution options | Haifa Hariri, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen | 2023-01-10 |
| 11508662 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Jonathan L. Rosch, Kristof Darmawikarta | 2022-11-22 |
| 11430740 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more | 2022-08-30 |
| 11043457 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Robert L. Sankman | 2021-06-22 |
| 10707168 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Robert L. Sankman | 2020-07-07 |
| 10553453 | Systems and methods for semiconductor packages using photoimageable layers | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amanda E. Schuckman, Amruthavalli P. Alur, Yikang Deng +1 more | 2020-02-04 |
| 10424561 | Integrated circuit structures with recessed conductive contacts for package on package | Kyu Oh Lee, Ram Viswanath, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali | 2019-09-24 |
| 10306760 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Yonggang Li, Charan Gurumurthy, Hamid Azimi | 2019-05-28 |
| 10286488 | Acousto-optics deflector and mirror for laser beam steering | Chong Zhang | 2019-05-14 |
| 10163798 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Robert L. Sankman | 2018-12-25 |
| 10043740 | Package with passivated interconnects | Sri Ranga Sai Boyapati, Rahul N. Manepalli, Dilan Seneviratne, Srinivas V. Pietambaram, Kristof Darmawikarta +1 more | 2018-08-07 |
| 9952823 | Architecture for seamless integrated display system | Johanna M. Swan, Uygar E. Avci, Ravi Pillarisetty | 2018-04-24 |
| 9941158 | Integrated circuit and process for fabricating thereof | Charan Gurumurthy, Houssam Jomaa, Ravi Tanikella | 2018-04-10 |
| 9865568 | Integrated circuit structures with recessed conductive contacts for package on package | Kyu Oh Lee, Ram Viswanath, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali | 2018-01-09 |
| 9842832 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2017-12-12 |
| 9820390 | Process for forming a semiconductor device substrate | Mihir K. Roy, Yonggang Li | 2017-11-14 |
| 9648733 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Yonggang Li, Charan Gurumurthy, Hamid Azimi | 2017-05-09 |
| 9505607 | Methods of forming sensor integrated packages and structures formed thereby | Kyu Oh Lee, Zheng Zhou, Feras Eid, Sasha N. Oster, Lay Wai Kong +1 more | 2016-11-29 |
| 9442286 | Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrate | Yonggang Li, Chong Zhang | 2016-09-13 |