| 12046560 |
Microelectronic device with embedded die substrate on interposer |
Robert Alan May, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more |
2024-07-23 |
$20,446,000 |
| 12040276 |
Device and method of very high density routing used with embedded multi-die interconnect bridge |
Robert Alan May, Wei-Lun Kane Jen, Jonathan L. Rosch, Kristof Darmawikarta |
2024-07-16 |
$26,089,000 |
| 12014989 |
Device and method of very high density routing used with embedded multi-die interconnect bridge |
Robert Alan May, Wei-Lun Kane Jen, Jonathan L. Rosch, Kristof Darmawikarta |
2024-06-18 |
$26,452,000 |
| 11894311 |
Microelectronic device with embedded die substrate on interposer |
Robert Alan May, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more |
2024-02-06 |
$35,892,000 |
| 11764158 |
Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same |
Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Robert L. Sankman |
2023-09-19 |
$20,015,000 |
| 11581271 |
Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate |
Rahul Jain, Kyu Oh Lee, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen, Yongki Min +1 more |
2023-02-14 |
$12,790,000 |
| 11552019 |
Substrate patch reconstitution options |
Haifa Hariri, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen |
2023-01-10 |
$14,061,000 |
| 11508662 |
Device and method of very high density routing used with embedded multi-die interconnect bridge |
Robert Alan May, Wei-Lun Kane Jen, Jonathan L. Rosch, Kristof Darmawikarta |
2022-11-22 |
$12,862,000 |
| 11430740 |
Microelectronic device with embedded die substrate on interposer |
Robert Alan May, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more |
2022-08-30 |
$13,077,000 |
| 11043457 |
Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same |
Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Robert L. Sankman |
2021-06-22 |
$40,504,000 |
| 10707168 |
Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same |
Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Robert L. Sankman |
2020-07-07 |
$29,601,000 |
| 10553453 |
Systems and methods for semiconductor packages using photoimageable layers |
Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amanda E. Schuckman, Amruthavalli P. Alur, Yikang Deng +1 more |
2020-02-04 |
$21,361,000 |
| 10424561 |
Integrated circuit structures with recessed conductive contacts for package on package |
Kyu Oh Lee, Ram Viswanath, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali |
2019-09-24 |
$28,939,000 |
| 10306760 |
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
Yonggang Li, Charan Gurumurthy, Hamid Azimi |
2019-05-28 |
$17,387,000 |
| 10286488 |
Acousto-optics deflector and mirror for laser beam steering |
Chong Zhang |
2019-05-14 |
$24,469,000 |
| 10163798 |
Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same |
Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Robert L. Sankman |
2018-12-25 |
|
| 10043740 |
Package with passivated interconnects |
Sri Ranga Sai Boyapati, Rahul N. Manepalli, Dilan Seneviratne, Srinivas V. Pietambaram, Kristof Darmawikarta +1 more |
2018-08-07 |
$25,284,000 |
| 9952823 |
Architecture for seamless integrated display system |
Johanna M. Swan, Uygar E. Avci, Ravi Pillarisetty |
2018-04-24 |
$19,097,000 |
| 9941158 |
Integrated circuit and process for fabricating thereof |
Charan Gurumurthy, Houssam Jomaa, Ravi Tanikella |
2018-04-10 |
$20,820,000 |
| 9865568 |
Integrated circuit structures with recessed conductive contacts for package on package |
Kyu Oh Lee, Ram Viswanath, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali |
2018-01-09 |
$14,051,000 |
| 9842832 |
High density interconnection of microelectronic devices |
Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more |
2017-12-12 |
$18,742,000 |
| 9820390 |
Process for forming a semiconductor device substrate |
Mihir K. Roy, Yonggang Li |
2017-11-14 |
$11,178,000 |
| 9648733 |
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
Yonggang Li, Charan Gurumurthy, Hamid Azimi |
2017-05-09 |
$10,144,000 |
| 9505607 |
Methods of forming sensor integrated packages and structures formed thereby |
Kyu Oh Lee, Zheng Zhou, Feras Eid, Sasha N. Oster, Lay Wai Kong +1 more |
2016-11-29 |
$9,403,000 |
| 9442286 |
Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrate |
Yonggang Li, Chong Zhang |
2016-09-13 |
$11,798,000 |
