Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device and method of very high density routing used with embedded multi-die interconnect bridge

Device and method of very high density routing used with embedded multi-die interconnect bridge

US Patent 11508662 · Granted Nov 22, 2022

Estimated economic value: $12,862,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Photonic interconnect and components in glass2025
Integrated optical coupler2025
Substrate integrated thin film capacitors using amorphous high-k dielectrics2025
Glass substrates having transverse capacitors for use with semiconductor package2025
Systems and methods for cloud based root service application across multiple coo2025
Glass interposer optical switching device and method2025
Omni directional interconnect with magnetic fillers in mold matrix2025
Optimization for raster scanning2025
Lithographic cavity formation to enable EMIB bump pitch scaling2025
Lithographic cavity formation to enable EMIB bump pitch scaling2025
First layer interconnect first on carrier approach for EMIB patch2025
Die last and waveguide last architecture for silicon photonic packaging2025