Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12336196 | Magnetic core inductors on package substrates | Krishna Bharath, Huong Do, Amruthavalli Pallavi Alur | 2025-06-17 |
| 12327773 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Vipul V. Mehta, Ashish Dhall +4 more | 2025-06-10 |
| 12068172 | Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages | Tarek A. Ibrahim, Rahul N. Manepalli, Steve Cho, Jason M. Gamba, Javier Soto Gonzalez | 2024-08-20 |
| 12040276 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Jonathan L. Rosch, Islam A. Salama, Kristof Darmawikarta | 2024-07-16 |
| 12014989 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Jonathan L. Rosch, Islam A. Salama, Kristof Darmawikarta | 2024-06-18 |
| 12002762 | High density organic bridge device and method | Mihir K. Roy, Stefanie M. Lotz | 2024-06-04 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Vipul V. Mehta, Ashish Dhall +4 more | 2024-03-19 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more | 2024-03-05 |
| 11769719 | Dual trace thickness for single layer routing | Jonathan L. Rosch, Cheng Xu, Liwei Cheng, Andrew J. Brown, Yikang Deng | 2023-09-26 |
| 11764150 | Inductors for package substrates | Sri Chaitra Jyotsna Chavali, Tarek A. Ibrahim | 2023-09-19 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Vipul V. Mehta, Ashish Dhall +4 more | 2023-05-30 |
| 11581271 | Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate | Rahul Jain, Kyu Oh Lee, Islam A. Salama, Amruthavalli Pallavi Alur, Yongki Min +1 more | 2023-02-14 |
| 11552019 | Substrate patch reconstitution options | Haifa Hariri, Amruthavalli Pallavi Alur, Islam A. Salama | 2023-01-10 |
| 11521931 | Microelectronic structures including bridges | Jason M. Gamba, Nitin A. Deshpande, Mohit Bhatia, Omkar G. Karhade, Bai Nie +2 more | 2022-12-06 |
| 11508662 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Jonathan L. Rosch, Islam A. Salama, Kristof Darmawikarta | 2022-11-22 |
| 11443970 | Methods of forming a package substrate | Manohar S. Konchady, Tao Wu, Mihir K. Roy, Yi Li | 2022-09-13 |
| 11270959 | Enabling magnetic films in inductors integrated into semiconductor packages | Kirstof Darmawikarta, Srinivas V. Pietambaram, Prithwish Chatterjee, Sri Ranga Sai Boyapati | 2022-03-08 |
| 11158558 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Vipul V. Mehta, Ashish Dhall +4 more | 2021-10-26 |
| 10978399 | Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate | Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Javier Soto Gonzalez | 2021-04-13 |
| 10980129 | Asymmetric electronic substrate and method of manufacture | Sri Chaitra Jyotsna Chavali, Amruthavalli Pallavi Alur, Sriram Srinivasan | 2021-04-13 |
| 10916486 | Semiconductor device including silane based adhesion promoter and method of making | Andrew J. Brown, Chi-Mon Chen, Robert Alan May, Amanda E. Schuckman | 2021-02-09 |
| 10672713 | High density organic bridge device and method | Mihir K. Roy, Stefanie M. Lotz | 2020-06-02 |
| 10658198 | Solder resist layer structures for terminating de-featured components and methods of making the same | Li-Sheng Weng, Chi-Te Chen, Olivia Chen, Yun Ling | 2020-05-19 |
| 10629469 | Solder resist layers for coreless packages and methods of fabrication | Manohar S. Konchady, Tao Wu, Mihir K. Roy, Yi Li | 2020-04-21 |
| 10624213 | Asymmetric electronic substrate and method of manufacture | Sri Chaitra Jyotsna Chavali, Amruthavalli Pallavi Alur, Sriram Srinivasan | 2020-04-14 |