Issued Patents All Time
Showing 25 most recent of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288744 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Ji-Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Liwei Cheng +2 more | 2025-04-29 |
| 12246532 | Vacuum aperture valve array | Anderson McKeague | 2025-03-11 |
| 11981512 | Substrate support system for a conveyor printer | Anderson McKeague | 2024-05-14 |
| 11881463 | Coreless organic packages with embedded die and magnetic inductor structures | Rahul Jain, Prithwish Chatterjee, Lauren A. Link, Sai Vadlamani | 2024-01-23 |
| 11862552 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link +2 more | 2024-01-02 |
| 11830809 | Magnetic structures in integrated circuit package supports | Ying Wang, Yikang Deng, Junnan Zhao, Cheng Xu, Kaladhar Radhakrishnan | 2023-11-28 |
| 11824013 | Package substrate with reduced interconnect stress | Lauren A. Link, Sheng Li, Sandeep B. Sane | 2023-11-21 |
| 11804455 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Prithwish Chatterjee | 2023-10-31 |
| 11769719 | Dual trace thickness for single layer routing | Jonathan L. Rosch, Wei-Lun Kane Jen, Cheng Xu, Liwei Cheng, Yikang Deng | 2023-09-26 |
| 11737208 | Microelectronic assemblies having conductive structures with different thicknesses | Brandon C. Marin, Rahul Jain, Dilan Seneviratne, Praneeth Akkinepally, Frank Truong | 2023-08-22 |
| 11705389 | Vias for package substrates | Luke Garner, Liwei Cheng, Lauren A. Link, Cheng Xu, Ying Wang +2 more | 2023-07-18 |
| 11670504 | Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives | Jeremy Ecton, Brandon C. Marin, Dilan Seneviratne | 2023-06-06 |
| 11651902 | Patterning of thin film capacitors in organic substrate packages | Rahul Jain, Prithwish Chatterjee, Sai Vadlamani, Lauren A. Link | 2023-05-16 |
| 11622448 | Sandwich-molded cores for high-inductance architectures | Brandon C. Marin, Tarek A. Ibrahim, Srinivas V. Pietambaram, Gang Duan, Jeremy Ecton +1 more | 2023-04-04 |
| 11610706 | Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates | Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Kyu Oh Lee, Sheng Li +1 more | 2023-03-21 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more | 2023-02-07 |
| 11552010 | Dielectric for high density substrate interconnects | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta | 2023-01-10 |
| 11552008 | Asymmetric cored integrated circuit package supports | Lauren A. Link, Prithwish Chatterjee, Sai Vadlamani, Ying Wang, Chong Zhang | 2023-01-10 |
| 11508636 | Multi-layer solution based deposition of dielectrics for advanced substrate architectures | Ji-Yong Park, Siddharth K. Alur, Cheng Xu, Amruthavalli Pallavi Alur | 2022-11-22 |
| 11495555 | Magnetic bilayer structure for a cored or coreless semiconductor package | Yikang Deng, Jonathan L. Rosch, Junnan Zhao | 2022-11-08 |
| 11495552 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Prithwish Chatterjee | 2022-11-08 |
| 11444042 | Magnetic structures in integrated circuit packages | Ying Wang, Chong Zhang, Lauren A. Link, Yikang Deng | 2022-09-13 |
| 11380609 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Cheng Xu, Jiwei Sun, Ji-Yong Park, Kyu Oh Lee, Yikang Deng +2 more | 2022-07-05 |
| 11335632 | Magnetic inductor structures for package devices | Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain +3 more | 2022-05-17 |
| 11317955 | Magnesium enhanced/induced bone formation | Charles S. Sfeir, Amy Chaya, Sayuri Smith | 2022-05-03 |