| 12288744 |
Microelectronic assemblies having conductive structures with different thicknesses on a core substrate |
Ji-Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Liwei Cheng +2 more |
2025-04-29 |
|
| 12246532 |
Vacuum aperture valve array |
Anderson McKeague |
2025-03-11 |
|
| 11981512 |
Substrate support system for a conveyor printer |
Anderson McKeague |
2024-05-14 |
|
| 11881463 |
Coreless organic packages with embedded die and magnetic inductor structures |
Rahul Jain, Prithwish Chatterjee, Lauren A. Link, Sai Vadlamani |
2024-01-23 |
$52,361,000 |
| 11862552 |
Methods of embedding magnetic structures in substrates |
Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link +2 more |
2024-01-02 |
$30,016,000 |
| 11830809 |
Magnetic structures in integrated circuit package supports |
Ying Wang, Yikang Deng, Junnan Zhao, Cheng Xu, Kaladhar Radhakrishnan |
2023-11-28 |
$31,872,000 |
| 11824013 |
Package substrate with reduced interconnect stress |
Lauren A. Link, Sheng Li, Sandeep B. Sane |
2023-11-21 |
$28,968,000 |
| 11804455 |
Substrate integrated thin film capacitors using amorphous high-k dielectrics |
Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Prithwish Chatterjee |
2023-10-31 |
$30,374,000 |
| 11769719 |
Dual trace thickness for single layer routing |
Jonathan L. Rosch, Wei-Lun Kane Jen, Cheng Xu, Liwei Cheng, Yikang Deng |
2023-09-26 |
$20,953,000 |
| 11737208 |
Microelectronic assemblies having conductive structures with different thicknesses |
Brandon C. Marin, Rahul Jain, Dilan Seneviratne, Praneeth Akkinepally, Frank Truong |
2023-08-22 |
$16,803,000 |
| 11705389 |
Vias for package substrates |
Luke Garner, Liwei Cheng, Lauren A. Link, Cheng Xu, Ying Wang +2 more |
2023-07-18 |
$21,060,000 |
| 11670504 |
Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives |
Jeremy Ecton, Brandon C. Marin, Dilan Seneviratne |
2023-06-06 |
$21,341,000 |
| 11651902 |
Patterning of thin film capacitors in organic substrate packages |
Rahul Jain, Prithwish Chatterjee, Sai Vadlamani, Lauren A. Link |
2023-05-16 |
$11,130,000 |
| 11622448 |
Sandwich-molded cores for high-inductance architectures |
Brandon C. Marin, Tarek A. Ibrahim, Srinivas V. Pietambaram, Gang Duan, Jeremy Ecton +1 more |
2023-04-04 |
$21,090,000 |
| 11610706 |
Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates |
Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Kyu Oh Lee, Sheng Li +1 more |
2023-03-21 |
$20,076,000 |
| 11574874 |
Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch |
Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more |
2023-02-07 |
$11,877,000 |
| 11552010 |
Dielectric for high density substrate interconnects |
Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta |
2023-01-10 |
$14,061,000 |
| 11552008 |
Asymmetric cored integrated circuit package supports |
Lauren A. Link, Prithwish Chatterjee, Sai Vadlamani, Ying Wang, Chong Zhang |
2023-01-10 |
$14,061,000 |
| 11508636 |
Multi-layer solution based deposition of dielectrics for advanced substrate architectures |
Ji-Yong Park, Siddharth K. Alur, Cheng Xu, Amruthavalli Pallavi Alur |
2022-11-22 |
$12,862,000 |
| 11495552 |
Substrate integrated thin film capacitors using amorphous high-k dielectrics |
Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Prithwish Chatterjee |
2022-11-08 |
$15,080,000 |
| 11495555 |
Magnetic bilayer structure for a cored or coreless semiconductor package |
Yikang Deng, Jonathan L. Rosch, Junnan Zhao |
2022-11-08 |
$15,080,000 |
| 11444042 |
Magnetic structures in integrated circuit packages |
Ying Wang, Chong Zhang, Lauren A. Link, Yikang Deng |
2022-09-13 |
$14,653,000 |
| 11380609 |
Microelectronic assemblies having conductive structures with different thicknesses on a core substrate |
Cheng Xu, Jiwei Sun, Ji-Yong Park, Kyu Oh Lee, Yikang Deng +2 more |
2022-07-05 |
$18,093,000 |
| 11335632 |
Magnetic inductor structures for package devices |
Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain +3 more |
2022-05-17 |
$14,251,000 |
| 11317955 |
Magnesium enhanced/induced bone formation |
Charles S. Sfeir, Amy Chaya, Sayuri Smith |
2022-05-03 |
|
