| 11881463 |
Coreless organic packages with embedded die and magnetic inductor structures |
Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Sai Vadlamani |
2024-01-23 |
$52,361,000 |
| 11862552 |
Methods of embedding magnetic structures in substrates |
Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Andrew J. Brown +2 more |
2024-01-02 |
$30,016,000 |
| 11824013 |
Package substrate with reduced interconnect stress |
Andrew J. Brown, Sheng Li, Sandeep B. Sane |
2023-11-21 |
$28,968,000 |
| 11705389 |
Vias for package substrates |
Andrew J. Brown, Luke Garner, Liwei Cheng, Cheng Xu, Ying Wang +2 more |
2023-07-18 |
$21,060,000 |
| 11651902 |
Patterning of thin film capacitors in organic substrate packages |
Rahul Jain, Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani |
2023-05-16 |
$11,130,000 |
| 11610706 |
Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates |
Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Kyu Oh Lee, Sheng Li +1 more |
2023-03-21 |
$20,076,000 |
| 11574874 |
Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch |
Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more |
2023-02-07 |
$11,877,000 |
| 11552008 |
Asymmetric cored integrated circuit package supports |
Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani, Ying Wang, Chong Zhang |
2023-01-10 |
$14,061,000 |
| 11444042 |
Magnetic structures in integrated circuit packages |
Andrew J. Brown, Ying Wang, Chong Zhang, Yikang Deng |
2022-09-13 |
$14,653,000 |
| 11335632 |
Magnetic inductor structures for package devices |
Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain +3 more |
2022-05-17 |
$14,251,000 |
| 11289263 |
Electronic substrates having embedded magnetic material using photo-imagable dielectric layers |
Sai Vadlamani, Prithwish Chatterjee, Andrew J. Brown |
2022-03-29 |
$28,068,000 |
| 11251113 |
Methods of embedding magnetic structures in substrates |
Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Andrew J. Brown +2 more |
2022-02-15 |
$14,138,000 |
| 11205626 |
Coreless organic packages with embedded die and magnetic inductor structures |
Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Sai Vadlamani |
2021-12-21 |
$33,282,000 |
| 11189409 |
Electronic substrates having embedded dielectric magnetic material to form inductors |
Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani |
2021-11-30 |
$30,212,000 |
| 11075130 |
Package substrate having polymer-derived ceramic core |
Lisa Ying Ying Chen, Robert Alan May, Amruthavalli Pallavi Alur, Kristof Darmawikarta, Siddharth K. Alur +3 more |
2021-07-27 |
$27,337,000 |
| 10741947 |
Plated through hole socketing coupled to a solder ball to engage with a pin |
Amruthavalli Pallavi Alur, Siddharth K. Alur, Liwei Cheng, Jonathan L. Rosch, Sai Vadlamani +1 more |
2020-08-11 |
$37,011,000 |
| 10700021 |
Coreless organic packages with embedded die and magnetic inductor structures |
Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Sai Vadlamani |
2020-06-30 |
$33,333,000 |
