Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11881463 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Sai Vadlamani | 2024-01-23 |
| 11862552 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Andrew J. Brown +2 more | 2024-01-02 |
| 11824013 | Package substrate with reduced interconnect stress | Andrew J. Brown, Sheng Li, Sandeep B. Sane | 2023-11-21 |
| 11705389 | Vias for package substrates | Andrew J. Brown, Luke Garner, Liwei Cheng, Cheng Xu, Ying Wang +2 more | 2023-07-18 |
| 11651902 | Patterning of thin film capacitors in organic substrate packages | Rahul Jain, Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani | 2023-05-16 |
| 11610706 | Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates | Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Kyu Oh Lee, Sheng Li +1 more | 2023-03-21 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more | 2023-02-07 |
| 11552008 | Asymmetric cored integrated circuit package supports | Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani, Ying Wang, Chong Zhang | 2023-01-10 |
| 11444042 | Magnetic structures in integrated circuit packages | Andrew J. Brown, Ying Wang, Chong Zhang, Yikang Deng | 2022-09-13 |
| 11335632 | Magnetic inductor structures for package devices | Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain +3 more | 2022-05-17 |
| 11289263 | Electronic substrates having embedded magnetic material using photo-imagable dielectric layers | Sai Vadlamani, Prithwish Chatterjee, Andrew J. Brown | 2022-03-29 |
| 11251113 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Andrew J. Brown +2 more | 2022-02-15 |
| 11205626 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Sai Vadlamani | 2021-12-21 |
| 11189409 | Electronic substrates having embedded dielectric magnetic material to form inductors | Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani | 2021-11-30 |
| 11075130 | Package substrate having polymer-derived ceramic core | Lisa Ying Ying Chen, Robert Alan May, Amruthavalli Pallavi Alur, Kristof Darmawikarta, Siddharth K. Alur +3 more | 2021-07-27 |
| 10741947 | Plated through hole socketing coupled to a solder ball to engage with a pin | Amruthavalli Pallavi Alur, Siddharth K. Alur, Liwei Cheng, Jonathan L. Rosch, Sai Vadlamani +1 more | 2020-08-11 |
| 10700021 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Sai Vadlamani | 2020-06-30 |