LC

Lisa Ying Ying Chen

IN Intel: 1 patents #18,218 of 30,777Top 60%
Overall (All Time): #2,740,620 of 4,157,543Top 70%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11075130 Package substrate having polymer-derived ceramic core Lauren A. Link, Robert Alan May, Amruthavalli Pallavi Alur, Kristof Darmawikarta, Siddharth K. Alur +3 more 2021-07-27