| 12336197 |
In-plane inductors in IC packages |
Brandon C. Marin, Tarek A. Ibrahim, Prithwish Chatterjee, Haifa Hariri, Yikang Deng +1 more |
2025-06-17 |
|
| 12230563 |
Method to enable 30 microns pitch EMIB or below |
Hongxia Feng, Dingying Xu, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan |
2025-02-18 |
|
| 12046560 |
Microelectronic device with embedded die substrate on interposer |
Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Robert L. Sankman +1 more |
2024-07-23 |
$20,446,000 |
| 11894311 |
Microelectronic device with embedded die substrate on interposer |
Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Robert L. Sankman +1 more |
2024-02-06 |
$35,892,000 |
| 11862552 |
Methods of embedding magnetic structures in substrates |
Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link +2 more |
2024-01-02 |
$30,016,000 |
| 11824013 |
Package substrate with reduced interconnect stress |
Lauren A. Link, Andrew J. Brown, Sandeep B. Sane |
2023-11-21 |
$28,968,000 |
| 11676891 |
Method to enable 30 microns pitch EMIB or below |
Hongxia Feng, Dingying Xu, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan |
2023-06-13 |
$22,204,000 |
| 11651885 |
Magnetic core inductors |
Junnan Zhao, Ying Wang, Cheng Xu, Kyu Oh Lee, Yikang Deng |
2023-05-16 |
$11,130,000 |
| 11622448 |
Sandwich-molded cores for high-inductance architectures |
Brandon C. Marin, Tarek A. Ibrahim, Srinivas V. Pietambaram, Andrew J. Brown, Gang Duan +1 more |
2023-04-04 |
$21,090,000 |
| 11610706 |
Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates |
Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Kyu Oh Lee, Andrew J. Brown +1 more |
2023-03-21 |
$20,076,000 |
| 11581271 |
Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate |
Rahul Jain, Kyu Oh Lee, Islam A. Salama, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen +1 more |
2023-02-14 |
$12,790,000 |
| 11430740 |
Microelectronic device with embedded die substrate on interposer |
Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Robert L. Sankman +1 more |
2022-08-30 |
$13,077,000 |
| 11393762 |
Formation of tall metal pillars using multiple photoresist layers |
Sri Chaitra Jyotsna Chavali, Liwei Cheng, Siddharth K. Alur |
2022-07-19 |
$11,394,000 |
| 11335632 |
Magnetic inductor structures for package devices |
Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain +3 more |
2022-05-17 |
$14,251,000 |
| 11251113 |
Methods of embedding magnetic structures in substrates |
Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link +2 more |
2022-02-15 |
$14,138,000 |
| 11196165 |
Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications |
Sri Chaitra Jyotsna Chavali, Siddharth K. Alur |
2021-12-07 |
$28,128,000 |
| 11088062 |
Method to enable 30 microns pitch EMIB or below |
Hongxia Feng, Dingying Xu, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan |
2021-08-10 |
$36,027,000 |
| 10775873 |
Performing power management in a multicore processor |
Victor W. Lee, Edward T. Grochowski, Daehyun Kim, Yuxin Bai, Naveen Mellempudi +1 more |
2020-09-15 |
$34,212,000 |
| 10716372 |
Umbrella frame bending structure for two-fold inverted umbrella |
— |
2020-07-21 |
|
| 10692965 |
3D conductive ink printing method and inductor formed thereof |
Chong Zhang, Andrew J. Brown, Sai Vadlamani, Ying Wang |
2020-06-23 |
$27,746,000 |
| 10672859 |
Embedded magnetic inductor |
Andrew J. Brown, Rahul Jain, Sai Vadlamani, Chong Zhang |
2020-06-02 |
$32,838,000 |
| 10660415 |
Umbrella frame structure for two-fold inverted umbrella |
— |
2020-05-26 |
|
| 10664199 |
Application driven hardware cache management |
Subramanya R. Dulloor, Rajesh M. Sankaran, David A. Koufaty, Christopher J. Hughes, Jong Soo Park |
2020-05-26 |
$31,191,000 |
| 10617185 |
Umbrella with umbrella cloth connected using retaining blocks |
— |
2020-04-14 |
|
| 10575610 |
Two-stage folding structure for two-fold inverted umbrella |
— |
2020-03-03 |
|