Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12336197 | In-plane inductors in IC packages | Brandon C. Marin, Tarek A. Ibrahim, Prithwish Chatterjee, Haifa Hariri, Yikang Deng +1 more | 2025-06-17 |
| 12230563 | Method to enable 30 microns pitch EMIB or below | Hongxia Feng, Dingying Xu, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan | 2025-02-18 |
| 12046560 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Robert L. Sankman +1 more | 2024-07-23 |
| 11894311 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Robert L. Sankman +1 more | 2024-02-06 |
| 11862552 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link +2 more | 2024-01-02 |
| 11824013 | Package substrate with reduced interconnect stress | Lauren A. Link, Andrew J. Brown, Sandeep B. Sane | 2023-11-21 |
| 11676891 | Method to enable 30 microns pitch EMIB or below | Hongxia Feng, Dingying Xu, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan | 2023-06-13 |
| 11651885 | Magnetic core inductors | Junnan Zhao, Ying Wang, Cheng Xu, Kyu Oh Lee, Yikang Deng | 2023-05-16 |
| 11622448 | Sandwich-molded cores for high-inductance architectures | Brandon C. Marin, Tarek A. Ibrahim, Srinivas V. Pietambaram, Andrew J. Brown, Gang Duan +1 more | 2023-04-04 |
| 11610706 | Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates | Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Kyu Oh Lee, Andrew J. Brown +1 more | 2023-03-21 |
| 11581271 | Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate | Rahul Jain, Kyu Oh Lee, Islam A. Salama, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen +1 more | 2023-02-14 |
| 11430740 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Robert L. Sankman +1 more | 2022-08-30 |
| 11393762 | Formation of tall metal pillars using multiple photoresist layers | Sri Chaitra Jyotsna Chavali, Liwei Cheng, Siddharth K. Alur | 2022-07-19 |
| 11335632 | Magnetic inductor structures for package devices | Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain +3 more | 2022-05-17 |
| 11251113 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link +2 more | 2022-02-15 |
| 11196165 | Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur | 2021-12-07 |
| 11088062 | Method to enable 30 microns pitch EMIB or below | Hongxia Feng, Dingying Xu, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan | 2021-08-10 |
| 10775873 | Performing power management in a multicore processor | Victor W. Lee, Edward T. Grochowski, Daehyun Kim, Yuxin Bai, Naveen Mellempudi +1 more | 2020-09-15 |
| 10716372 | Umbrella frame bending structure for two-fold inverted umbrella | — | 2020-07-21 |
| 10692965 | 3D conductive ink printing method and inductor formed thereof | Chong Zhang, Andrew J. Brown, Sai Vadlamani, Ying Wang | 2020-06-23 |
| 10672859 | Embedded magnetic inductor | Andrew J. Brown, Rahul Jain, Sai Vadlamani, Chong Zhang | 2020-06-02 |
| 10664199 | Application driven hardware cache management | Subramanya R. Dulloor, Rajesh M. Sankaran, David A. Koufaty, Christopher J. Hughes, Jong Soo Park | 2020-05-26 |
| 10660415 | Umbrella frame structure for two-fold inverted umbrella | — | 2020-05-26 |
| 10617185 | Umbrella with umbrella cloth connected using retaining blocks | — | 2020-04-14 |
| 10575610 | Two-stage folding structure for two-fold inverted umbrella | — | 2020-03-03 |