| 12498520 |
Integrated optical coupler |
Hisato Tanaka, Kristof Darmawikarta, Srinivas V. Pietambaram |
2025-12-16 |
|
| 12481108 |
Faraday rotator interconnect as a through-via configuration in a patch architecture |
Divya Pratap, Hisato Tanaka, Nitin A. Deshpande, Omkar G. Karhade, Robert A. May +5 more |
2025-11-25 |
|
| 12449600 |
Position controlled waveguides and methods of manufacturing the same |
Jeremy Ecton, Leonel Arana, Whitney Bryks, Haobo Chen, Benjamin Duong +2 more |
2025-10-21 |
|
| 12444672 |
Hybrid bonding technologies with thermal expansion compensation structures |
Jeremy Ecton, Aleksandar Aleksov, Hisato Tanaka, Srinivas V. Pietambaram, Xavier Francois Brun |
2025-10-14 |
|
| 12422615 |
Nested glass packaging architecture for hybrid electrical and optical communication devices |
Srinivas V. Pietambaram, Debendra Mallik, Tarek A. Ibrahim, Jeremy Ecton, Omkar G. Karhade +5 more |
2025-09-23 |
|
| 12412868 |
Microelectronic assemblies including interconnects with different solder materials |
Jeremy Ecton, Jason M. Gamba, Srinivas V. Pietambaram, Xiaoxuan Sun, Omkar G. Karhade +6 more |
2025-09-09 |
|
| 12394719 |
Methods and apparatus to increase glass core thickness |
Jeremy Ecton, Srinivas V. Pietambaram, Bai Nie |
2025-08-19 |
|
| 12381029 |
Stepped coax MIL PTHS for modulating inductance within a package |
Krishna Bharath, Haifa Hariri, Tarek A. Ibrahim |
2025-08-05 |
|
| 12368511 |
Embedded faraday rotators and components for increasing bandwidth and/or reducing fiber count in photonics multi chip packages |
Kaveh Hosseini, Conor O'Keeffe, Hiroki Tanaka |
2025-07-22 |
|
| 12353070 |
Glass interposer optical switching device and method |
Hiroki Tanaka, Kristof Darmawikarta, Srinivas V. Pietambaram, Jeremy Ecton, Hari Mahalingam +1 more |
2025-07-08 |
|
| 12336197 |
In-plane inductors in IC packages |
Tarek A. Ibrahim, Prithwish Chatterjee, Haifa Hariri, Yikang Deng, Sheng Li +1 more |
2025-06-17 |
|
| 12327814 |
Electronic substrate core having an embedded laser stop to control depth of an ultra-deep cavity |
Sai Vadlamani, Omkar G. Karhade, Tolga Acikalin |
2025-06-10 |
|
| 12313890 |
Through-substrate optical vias |
Pooya Tadayon, Zhichao Zhang, Tarek A. Ibrahim, Kemal Aygun, Stephen Andrew Smith |
2025-05-27 |
|
| 12306480 |
Glass interposer optical resonator device and method |
Hiroki Tanaka, Kristof Darmawikarta, Srinivas V. Pietambaram, Jeremy Ecton, Rajeev Ranjan |
2025-05-20 |
|
| 12282174 |
Converting multiple light signals into and out of a single wavelength with multiple polarizations to increase optical bandwidth |
Kaveh Hosseini, Conor O'Keeffe, Hiroki Tanaka |
2025-04-22 |
|
| 12253722 |
Magneto-optical Kerr effect interconnects for photonic packaging |
Hiroki Tanaka, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati |
2025-03-18 |
|
| 12255147 |
Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein |
Jeremy Ecton, Srinivas V. Pietambaram, Suddhasattwa Nad |
2025-03-18 |
|
| 12255130 |
Airgap structures for high speed signal integrity |
Hongxia Feng, Jeremy Ecton, Aleksandar Aleksov, Haobo Chen, Xiaoying Guo +4 more |
2025-03-18 |
|
| 12230564 |
Package substrate z-disaggregation with liquid metal interconnects |
Tarek A. Ibrahim, Karumbu Meyyappan, Valery Ouvarov-Bancalero, Dingying Xu |
2025-02-18 |
|
| 12224103 |
Angled inductor with small form factor |
Jeremy Ecton, Suddhasattwa Nad, Matthew Tingey, Ravindranath V. Mahajan, Srinivas V. Pietambaram |
2025-02-11 |
|
| 12224253 |
Magnetic inductor device and method |
Xin Ning, Kyu Oh Lee, Siddharth K. Alur, Numair Ahmed, Brent Williams +3 more |
2025-02-11 |
|
| 12125777 |
Minimizing package impedance discontinuity through dielectric structure optimizations |
Zhiguo Qian, Gang Duan, Kemal Aygun, Jieying Kong |
2024-10-22 |
$18,859,000 |
| 12074102 |
Structural elements for application specific electronic device packages |
Suddhasattwa Nad, Ravindranath V. Mahajan, Jeremy Ecton, Mohammad Mamunur Rahman |
2024-08-27 |
$26,513,000 |
| 12057252 |
Electronic substrates having embedded inductors |
Benjamin Duong, Michael Garelick, Darko Grujicic, Tarek A. Ibrahim, Sai Vadlamani +1 more |
2024-08-06 |
$17,070,000 |
| 12033930 |
Selectively roughened copper architectures for low insertion loss conductive features |
Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more |
2024-07-09 |
$24,938,000 |
