Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230564 | Package substrate z-disaggregation with liquid metal interconnects | Brandon C. Marin, Tarek A. Ibrahim, Karumbu Meyyappan, Dingying Xu | 2025-02-18 |
| 12183688 | Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE | John Harper, Malavarayan Sankarasubramanian, Patrick Nardi, Bamidele Daniel Falola, Ravi Siddappa +1 more | 2024-12-31 |