Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12183688 | Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE | Valery Ouvarov-Bancalero, John Harper, Malavarayan Sankarasubramanian, Patrick Nardi, Ravi Siddappa +1 more | 2024-12-31 | $16,542,000 |
| 12166004 | Solder thermal interface material (STIM) with dopant | Susmriti Das Mahapatra, Amitesh Saha, Peng Li | 2024-12-10 | $13,394,000 |
| 11817369 | Lids for integrated circuit packages with solder thermal interface materials | Susmriti Das Mahapatra, Sergio Antonio Chan Arguedas, Peng Li, Amitesh Saha | 2023-11-14 | $31,444,000 |
| 11798861 | Integrated heat spreader (IHS) with heating element | Peng Li, Kelly Lofgreen, Manish Dubey, Ken Hackenberg, Shenavia S. Howell +3 more | 2023-10-24 | $20,059,000 |
| 11670569 | Channeled lids for integrated circuit packages | Manish Dubey, Amitesh Saha, Marco Aurelio Cartas, Peng Li | 2023-06-06 | $21,341,000 |