Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040246 | Chip-scale package architectures containing a die back side metal and a solder thermal interface material | Susmriti Das Mahapatra, Malavarayan Sankarasubramanian, John Harper, Mitul Modi | 2024-07-16 |
| 11798861 | Integrated heat spreader (IHS) with heating element | Peng Li, Kelly Lofgreen, Manish Dubey, Bamidele Daniel Falola, Ken Hackenberg +3 more | 2023-10-24 |
| 11682605 | Integrated circuit packages with asymmetric adhesion material regions | Karthik Visvanathan, Sergio Antonio Chan Arguedas, Peng Li | 2023-06-20 |
| 11652061 | Package-level backside metallization (BSM) | John J. Beatty, Raymond A. Krick, Suzana Prstic | 2023-05-16 |