Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11682605 | Integrated circuit packages with asymmetric adhesion material regions | Shenavia S. Howell, Sergio Antonio Chan Arguedas, Peng Li | 2023-06-20 | $18,411,000 |