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Protruding SN substrate features for epoxy flow control |
Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more |
2025-07-15 |
| 12334453 |
Soldered metallic reservoirs for enhanced transient and steady-state thermal performance |
Nicholas Neal, Nicholas S. Haehn, Edvin Cetegen, Jacob VEHONSKY, Steve Cho +4 more |
2025-06-17 |
| 12272614 |
Integrated circuit packages with solder thermal interface materials with embedded particles |
Amitesh Saha, Marco Aurelio Cartas, Ken Hackenberg, Peng Li |
2025-04-08 |
| 12238892 |
Immersion cooling for integrated circuit devices |
Raanan Sover, James D. Williams, Bradley H. Smith, Nir Peled, Paul C. GEORGE +9 more |
2025-02-25 |
| 12205915 |
Microelectronic package with solder array thermal interface material (SA-TIM) |
Debendra Mallik, Jimin Yao, Chandra Mohan Jha |
2025-01-21 |
| 12080620 |
Additively manufactured structures for heat dissipation from integrated circuit devices |
Feras Eid, Xavier Francois Brun, Paul Diglio, Joe Walczyk |
2024-09-03 |
| 12062592 |
Integrated circuit packages with thermal interface materials with different material compositions |
Amitesh Saha, Marco Aurelio Cartas, Ken Hackenberg, Emilio Tarango Valles |
2024-08-13 |
| 12009271 |
Protruding SN substrate features for epoxy flow control |
Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more |
2024-06-11 |
| 11935799 |
Integrated circuit package lids with polymer features |
Elah Bozorg-Grayeli, Taylor Gaines, Frederick Atadana, Robert F. Cheney |
2024-03-19 |
| 11894282 |
Vented lids for integrated circuit packages |
Zhimin Wan, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy, Cheng Xu +2 more |
2024-02-06 |
| 11881438 |
First-level integration of second-level thermal interface material for integrated circuit assemblies |
Elah Bozorg-Grayeli, Kyle Arrington, Aravindha R. Antoniswamy |
2024-01-23 |
| 11832419 |
Full package vapor chamber with IHS |
Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more |
2023-11-28 |
| 11817369 |
Lids for integrated circuit packages with solder thermal interface materials |
Bamidele Daniel Falola, Susmriti Das Mahapatra, Peng Li, Amitesh Saha |
2023-11-14 |
| 11798861 |
Integrated heat spreader (IHS) with heating element |
Peng Li, Kelly Lofgreen, Manish Dubey, Bamidele Daniel Falola, Ken Hackenberg +3 more |
2023-10-24 |
| 11791237 |
Microelectronic assemblies including a thermal interface material |
Peng Li, Yongmei Liu, Deepak Goyal, Ken Hackenberg |
2023-10-17 |
| 11776864 |
Corner guard for improved electroplated first level interconnect bump height range |
Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +4 more |
2023-10-03 |
| 11776869 |
Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense |
Feras Eid, Johanna M. Swan, John J. Beatty |
2023-10-03 |
| 11735552 |
Microelectronic package with solder array thermal interface material (SA-TIM) |
Debendra Mallik, Jimin Yao, Chandra Mohan Jha |
2023-08-22 |
| 11682605 |
Integrated circuit packages with asymmetric adhesion material regions |
Karthik Visvanathan, Shenavia S. Howell, Peng Li |
2023-06-20 |
| 11328979 |
Substrate integrated posts and heat spreader customization for enhanced package thermomechanics |
Feras Eid, Dinesh Padmanabhan Ramalekshmi Thanu, Johanna M. Swan, John J. Beatty |
2022-05-10 |
| 11328978 |
Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense |
Feras Eid, Johanna M. Swan, John J. Beatty |
2022-05-10 |
| 11112841 |
5G mmWave cooling through PCB |
Divya Mani, William J. Lambert, Shawna M. Liff, Robert L. Sankman |
2021-09-07 |
| 11004768 |
Multi-chip package with partial integrated heat spreader |
Muhammad Saiful Islam, Enisa Harris, Suzana Prstic, Sachin Deshmukh, Aravindha R. Antoniswamy +1 more |
2021-05-11 |
| 10672625 |
Electronic device package with recessed substrate for underfill containment |
Joshua D. Heppner, Jimin Yao |
2020-06-02 |