Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362250 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2025-07-15 |
| 12334453 | Soldered metallic reservoirs for enhanced transient and steady-state thermal performance | Nicholas Neal, Nicholas S. Haehn, Edvin Cetegen, Jacob VEHONSKY, Steve Cho +4 more | 2025-06-17 |
| 12272614 | Integrated circuit packages with solder thermal interface materials with embedded particles | Amitesh Saha, Marco Aurelio Cartas, Ken Hackenberg, Peng Li | 2025-04-08 |
| 12238892 | Immersion cooling for integrated circuit devices | Raanan Sover, James D. Williams, Bradley H. Smith, Nir Peled, Paul C. GEORGE +9 more | 2025-02-25 |
| 12205915 | Microelectronic package with solder array thermal interface material (SA-TIM) | Debendra Mallik, Jimin Yao, Chandra Mohan Jha | 2025-01-21 |
| 12080620 | Additively manufactured structures for heat dissipation from integrated circuit devices | Feras Eid, Xavier Francois Brun, Paul Diglio, Joe Walczyk | 2024-09-03 |
| 12062592 | Integrated circuit packages with thermal interface materials with different material compositions | Amitesh Saha, Marco Aurelio Cartas, Ken Hackenberg, Emilio Tarango Valles | 2024-08-13 |
| 12009271 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2024-06-11 |
| 11935799 | Integrated circuit package lids with polymer features | Elah Bozorg-Grayeli, Taylor Gaines, Frederick Atadana, Robert F. Cheney | 2024-03-19 |
| 11894282 | Vented lids for integrated circuit packages | Zhimin Wan, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy, Cheng Xu +2 more | 2024-02-06 |
| 11881438 | First-level integration of second-level thermal interface material for integrated circuit assemblies | Elah Bozorg-Grayeli, Kyle Arrington, Aravindha R. Antoniswamy | 2024-01-23 |
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more | 2023-11-28 |
| 11817369 | Lids for integrated circuit packages with solder thermal interface materials | Bamidele Daniel Falola, Susmriti Das Mahapatra, Peng Li, Amitesh Saha | 2023-11-14 |
| 11798861 | Integrated heat spreader (IHS) with heating element | Peng Li, Kelly Lofgreen, Manish Dubey, Bamidele Daniel Falola, Ken Hackenberg +3 more | 2023-10-24 |
| 11791237 | Microelectronic assemblies including a thermal interface material | Peng Li, Yongmei Liu, Deepak Goyal, Ken Hackenberg | 2023-10-17 |
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +4 more | 2023-10-03 |
| 11776869 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Feras Eid, Johanna M. Swan, John J. Beatty | 2023-10-03 |
| 11735552 | Microelectronic package with solder array thermal interface material (SA-TIM) | Debendra Mallik, Jimin Yao, Chandra Mohan Jha | 2023-08-22 |
| 11682605 | Integrated circuit packages with asymmetric adhesion material regions | Karthik Visvanathan, Shenavia S. Howell, Peng Li | 2023-06-20 |
| 11328979 | Substrate integrated posts and heat spreader customization for enhanced package thermomechanics | Feras Eid, Dinesh Padmanabhan Ramalekshmi Thanu, Johanna M. Swan, John J. Beatty | 2022-05-10 |
| 11328978 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Feras Eid, Johanna M. Swan, John J. Beatty | 2022-05-10 |
| 11112841 | 5G mmWave cooling through PCB | Divya Mani, William J. Lambert, Shawna M. Liff, Robert L. Sankman | 2021-09-07 |
| 11004768 | Multi-chip package with partial integrated heat spreader | Muhammad Saiful Islam, Enisa Harris, Suzana Prstic, Sachin Deshmukh, Aravindha R. Antoniswamy +1 more | 2021-05-11 |
| 10672625 | Electronic device package with recessed substrate for underfill containment | Joshua D. Heppner, Jimin Yao | 2020-06-02 |