| 12283535 |
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects |
Debendra Mallik, Je-Young Chang, Ram Viswanath, Ahmad Al Mohammad |
2025-04-22 |
| 11984377 |
IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects |
Debendra Mallik, Je-Young Chang, Ram Viswanath, Ahmad Al Mohammad |
2024-05-14 |
| 11935808 |
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects |
Debendra Mallik, Je-Young Chang, Ram Viswanath, Ahmad Al Mohammad |
2024-03-19 |
| 11935799 |
Integrated circuit package lids with polymer features |
Taylor Gaines, Frederick Atadana, Sergio Antonio Chan Arguedas, Robert F. Cheney |
2024-03-19 |
| 11923267 |
IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects |
Debendra Mallik, Je-Young Chang, Ram Viswanath, Ahmad Al Mohammad |
2024-03-05 |
| 11881440 |
Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds |
Marely E. Tejeda Ferrari, Taylor Gaines, James C. Matayabas, Jr. |
2024-01-23 |
| 11881438 |
First-level integration of second-level thermal interface material for integrated circuit assemblies |
Kyle Arrington, Sergio Antonio Chan Arguedas, Aravindha R. Antoniswamy |
2024-01-23 |
| 11869824 |
Thermal interface structures for integrated circuit packages |
Kyle Arrington, Aaron McCann, Kelly Lofgreen, Aravindha R. Antoniswamy, Joseph B. Petrini |
2024-01-09 |
| 11710672 |
Microelectronic package with underfilled sealant |
Taylor Gaines, Ken Hackenberg, Frederick Atadana |
2023-07-25 |
| 11710677 |
Ultraviolet (UV)-curable sealant in a microelectronic package |
Taylor Gaines, Ken Hackenberg |
2023-07-25 |
| 11004768 |
Multi-chip package with partial integrated heat spreader |
Muhammad Saiful Islam, Enisa Harris, Suzana Prstic, Sergio Antonio Chan Arguedas, Sachin Deshmukh +1 more |
2021-05-11 |
| 10569298 |
Substrate with epoxy cured by ultraviolet laser |
Michael Greenley |
2020-02-25 |
| 10475715 |
Two material high K thermal encapsulant system |
Venmathy McMahan, Sivakumar Nagarajan, Amrita Mallik, Kuang-Han Chu, Liwei Wang +3 more |
2019-11-12 |