Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more | 2025-07-08 |
| 12349303 | Low force liquid metal interconnect solutions | Karumbu Meyyappan, David Craig, Pooya Tadayon | 2025-07-01 |
| 12266589 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2025-04-01 |
| 12238892 | Immersion cooling for integrated circuit devices | Raanan Sover, James D. Williams, Bradley H. Smith, Nir Peled, Paul C. GEORGE +9 more | 2025-02-25 |
| 12091484 | Copolymer compatibilizers and uses thereof | John Matson, Kevin J. Edgar, Junyi Chen | 2024-09-17 |
| 12057369 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2024-08-06 |
| 12046536 | Integrated heat spreader with enhanced vapor chamber for multichip packages | Je-Young Chang, James C. Matayabas, Jr., Zhimin Wan | 2024-07-23 |
| 11923268 | Printed heat spreader structures and methods of providing same | Jesus Gerardo Reyes Schuldes, Shankar Devasenathipathy, Pramod Malatkar, Aravindha R. Antoniswamy | 2024-03-05 |
| 11881438 | First-level integration of second-level thermal interface material for integrated circuit assemblies | Elah Bozorg-Grayeli, Sergio Antonio Chan Arguedas, Aravindha R. Antoniswamy | 2024-01-23 |
| 11869824 | Thermal interface structures for integrated circuit packages | Aaron McCann, Kelly Lofgreen, Elah Bozorg-Grayeli, Aravindha R. Antoniswamy, Joseph B. Petrini | 2024-01-09 |
| 11854935 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2023-12-26 |
| 11842944 | IC assemblies including die perimeter frames suitable for containing thermal interface materials | Frederick Atadana, Taylor Gaines, Minseok Ha | 2023-12-12 |
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Aaron McCann, Edvin Cetegen +4 more | 2023-11-28 |
| 11679407 | Liquid metal thermal interface material application | Joseph Petrini, Aaron McCann, Shankar Devasenathipathy, James C. Matayabas, Jr., Mostafa Aghazadeh +1 more | 2023-06-20 |
| 11622466 | Low force liquid metal interconnect solutions | Karumbu Meyyappan, David Craig, Pooya Tadayon | 2023-04-04 |
| 11616000 | Methods and apparatus to provide electrical shielding for integrated circuit packages using a thermal interface material | Dong-Ho Han, Jaejin Lee, Jerrod Peterson | 2023-03-28 |