| 12354883 |
Omni directional interconnect with magnetic fillers in mold matrix |
Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more |
2025-07-08 |
|
| 12349303 |
Low force liquid metal interconnect solutions |
Karumbu Meyyappan, David Craig, Pooya Tadayon |
2025-07-01 |
|
| 12266589 |
Enhanced base die heat path using through-silicon vias |
Weston BERTRAND, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan |
2025-04-01 |
|
| 12238892 |
Immersion cooling for integrated circuit devices |
Raanan Sover, James D. Williams, Bradley H. Smith, Nir Peled, Paul C. GEORGE +9 more |
2025-02-25 |
|
| 12091484 |
Copolymer compatibilizers and uses thereof |
John Matson, Kevin J. Edgar, Junyi Chen |
2024-09-17 |
$427,759,000 |
| 12057369 |
Enhanced base die heat path using through-silicon vias |
Weston BERTRAND, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan |
2024-08-06 |
$17,070,000 |
| 12046536 |
Integrated heat spreader with enhanced vapor chamber for multichip packages |
Je-Young Chang, James C. Matayabas, Jr., Zhimin Wan |
2024-07-23 |
$20,446,000 |
| 11923268 |
Printed heat spreader structures and methods of providing same |
Jesus Gerardo Reyes Schuldes, Shankar Devasenathipathy, Pramod Malatkar, Aravindha R. Antoniswamy |
2024-03-05 |
$29,696,000 |
| 11881438 |
First-level integration of second-level thermal interface material for integrated circuit assemblies |
Elah Bozorg-Grayeli, Sergio Antonio Chan Arguedas, Aravindha R. Antoniswamy |
2024-01-23 |
$52,361,000 |
| 11869824 |
Thermal interface structures for integrated circuit packages |
Aaron McCann, Kelly Lofgreen, Elah Bozorg-Grayeli, Aravindha R. Antoniswamy, Joseph B. Petrini |
2024-01-09 |
$30,329,000 |
| 11854935 |
Enhanced base die heat path using through-silicon vias |
Weston BERTRAND, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan |
2023-12-26 |
$39,948,000 |
| 11842944 |
IC assemblies including die perimeter frames suitable for containing thermal interface materials |
Frederick Atadana, Taylor Gaines, Minseok Ha |
2023-12-12 |
$45,136,000 |
| 11832419 |
Full package vapor chamber with IHS |
Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Aaron McCann, Edvin Cetegen +4 more |
2023-11-28 |
$31,872,000 |
| 11679407 |
Liquid metal thermal interface material application |
Joseph Petrini, Aaron McCann, Shankar Devasenathipathy, James C. Matayabas, Jr., Mostafa Aghazadeh +1 more |
2023-06-20 |
$18,411,000 |
| 11622466 |
Low force liquid metal interconnect solutions |
Karumbu Meyyappan, David Craig, Pooya Tadayon |
2023-04-04 |
$21,090,000 |
| 11616000 |
Methods and apparatus to provide electrical shielding for integrated circuit packages using a thermal interface material |
Dong-Ho Han, Jaejin Lee, Jerrod Peterson |
2023-03-28 |
$20,940,000 |
