Patents per Year
Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12266589 | Enhanced base die heat path using through-silicon vias | Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2025-04-01 | |
| 12057369 | Enhanced base die heat path using through-silicon vias | Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2024-08-06 | $17,070,000 |
| 11854935 | Enhanced base die heat path using through-silicon vias | Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2023-12-26 | $39,948,000 |